Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Chip base ceramic local metallization device and process
The invention provides a chip base ceramic local metallization device and process, and relates to the technical field of chip base processing, the chip base ceramic local metallization device comprises moving parts, the moving parts are rectangular structures, the moving parts are made of metal aluminum materials, the bottom of each moving part is provided with uniformly arranged through grooves, each through groove is of an L-shaped structure, and the included angle position of the outer side of the top end of each through groove is of an arc-shaped structure. When the device is used, the moving part can be stressed to clamp the base, and due to the fact that the moving part is made of metal aluminum and can conduct heat rapidly, when the base is heated, the moving part can conduct auxiliary heating on the side edge of the base, heat can heat the side edge and the top end of the base at the same time, the heating effect is better, and heating is faster and more convenient. The metallization material can be melted more rapidly, and the problems that a ceramic local metallization device is prone to influencing the heating efficiency, heat is slowly transferred to the position above the base, and an auxiliary heat conduction structure is lacked are solved.
本发明提供了一种芯片底座陶瓷局部金属化装置及工艺，涉及芯片底座加工技术领域，包括：移动件，所述移动件为矩形结构，移动件为金属铝材质，每个移动件的底部设有均匀排列的通槽，通槽为L形结构，通槽的顶端外侧夹角位置为弧形结构。本装置在使用的时候，移动件可以受力将底座夹住，由于移动件为金属铝材质，可以快速导热，使在对底座加热时，移动件可以将底座的侧边辅助加热，使热量可以同时对底座侧边以及顶端进行加热，使加热效果更好，可以更加快速，使金属化材料可以更加快速融化,解决了陶瓷局部金属化装置，容易影响加热效率，使热量较慢的传递到底座的上方，缺少辅助导热结构的问题。
Chip base ceramic local metallization device and process
The invention provides a chip base ceramic local metallization device and process, and relates to the technical field of chip base processing, the chip base ceramic local metallization device comprises moving parts, the moving parts are rectangular structures, the moving parts are made of metal aluminum materials, the bottom of each moving part is provided with uniformly arranged through grooves, each through groove is of an L-shaped structure, and the included angle position of the outer side of the top end of each through groove is of an arc-shaped structure. When the device is used, the moving part can be stressed to clamp the base, and due to the fact that the moving part is made of metal aluminum and can conduct heat rapidly, when the base is heated, the moving part can conduct auxiliary heating on the side edge of the base, heat can heat the side edge and the top end of the base at the same time, the heating effect is better, and heating is faster and more convenient. The metallization material can be melted more rapidly, and the problems that a ceramic local metallization device is prone to influencing the heating efficiency, heat is slowly transferred to the position above the base, and an auxiliary heat conduction structure is lacked are solved.
本发明提供了一种芯片底座陶瓷局部金属化装置及工艺，涉及芯片底座加工技术领域，包括：移动件，所述移动件为矩形结构，移动件为金属铝材质，每个移动件的底部设有均匀排列的通槽，通槽为L形结构，通槽的顶端外侧夹角位置为弧形结构。本装置在使用的时候，移动件可以受力将底座夹住，由于移动件为金属铝材质，可以快速导热，使在对底座加热时，移动件可以将底座的侧边辅助加热，使热量可以同时对底座侧边以及顶端进行加热，使加热效果更好，可以更加快速，使金属化材料可以更加快速融化,解决了陶瓷局部金属化装置，容易影响加热效率，使热量较慢的传递到底座的上方，缺少辅助导热结构的问题。
Chip base ceramic local metallization device and process
一种芯片底座陶瓷局部金属化装置及工艺
ZHANG WEIXING (Autor:in) / JIANG GUOHUA (Autor:in) / CHEN CONGTIAN (Autor:in)
13.05.2022
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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