Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Brazing material, joined body, ceramic circuit board, and method for producing joined body
According to one embodiment of the present invention, a brazing filler metal for joining a ceramic substrate and a metal plate has an endothermic peak in the range of 550 DEG C to 700 DEG C in a temperature rise step when a differential scanning calorimeter (DSC) is used to measure a DSC curve. The brazing filler metal preferably contains Ag, Cu, and Ti. It is preferable that the brazing material have two or more endothermic peaks in the range of 550 DEG C to 650 DEG C in the temperature raising step.
根据实施方式，其特征在于，对于用于将陶瓷基板与金属板接合的钎料，在通过差示扫描量热计(DSC)来测定DSC曲线时，在升温工序的550℃～700℃的范围内具有吸热峰。此外，钎料优选含有Ag、Cu及Ti。此外，钎料优选在升温工序的550℃～650℃的范围内具有2个以上的吸热峰。
Brazing material, joined body, ceramic circuit board, and method for producing joined body
According to one embodiment of the present invention, a brazing filler metal for joining a ceramic substrate and a metal plate has an endothermic peak in the range of 550 DEG C to 700 DEG C in a temperature rise step when a differential scanning calorimeter (DSC) is used to measure a DSC curve. The brazing filler metal preferably contains Ag, Cu, and Ti. It is preferable that the brazing material have two or more endothermic peaks in the range of 550 DEG C to 650 DEG C in the temperature raising step.
根据实施方式，其特征在于，对于用于将陶瓷基板与金属板接合的钎料，在通过差示扫描量热计(DSC)来测定DSC曲线时，在升温工序的550℃～700℃的范围内具有吸热峰。此外，钎料优选含有Ag、Cu及Ti。此外，钎料优选在升温工序的550℃～650℃的范围内具有2个以上的吸热峰。
Brazing material, joined body, ceramic circuit board, and method for producing joined body
钎料、接合体、陶瓷电路基板及接合体的制造方法
YONETSU MAKI (Autor:in) / SUENAGA SEIICHI (Autor:in) / FUJISAWA SACHIKO (Autor:in) / SANO TAKASHI (Autor:in)
05.08.2022
Patent
Elektronische Ressource
Chinesisch
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