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Ceramic preparation method based on LTCC (Low Temperature Co-Fired Ceramic) substrate isostatic pressing lamination
The invention provides a ceramic preparation method based on LTCC (Low Temperature Co-Fired Ceramic) substrate isostatic pressing lamination. The ceramic preparation method based on LTCC substrate isostatic pressing lamination comprises the following steps: isostatic pressing lamination: stacking two or more layers of raw ceramic tapes, coating a layer of lamination binder between two adjacent raw ceramic tapes, and then carrying out isostatic pressing lamination at the lamination temperature of 20-50 DEG C under the pressure of 5-20 MPa for 5-20 min; sintering: in a room temperature-first temperature stage, the heating rate is controlled to be 0.3 DEG C/min-0. 6 DEG C/min, and heat preservation is performed for 2-4 hours at the first temperature; in the first temperature-highest temperature stage, the heating rate is 4 DEG C/min-7 DEG C/min, the highest temperature range is 830 DEG C-860 DEG C, and the highest temperature is kept for 10 min-30 min;
本发明提供了一种基于LTCC基片等静压叠层的陶瓷制备方法。所述基于LTCC基片等静压叠层的陶瓷制备方法包括如下步骤:等静压叠层:将两层或多层生瓷带叠放,在相邻两个所述生瓷带之间涂覆一层叠层粘结剂,然后进行等静压叠层,叠层温度20℃‑50℃,压力5MPa‑20MPa,保压时间5min‑20min;烧结:室温‑第一温度阶段:控制升温速率0.3℃/min‑0.6℃/min,第一温度下保温2小时‑4小时;第一温度‑最高温阶段:升温速率4℃/min‑7℃/min,最高温度范围830℃‑860℃,最高温保温10min‑30min。
Ceramic preparation method based on LTCC (Low Temperature Co-Fired Ceramic) substrate isostatic pressing lamination
The invention provides a ceramic preparation method based on LTCC (Low Temperature Co-Fired Ceramic) substrate isostatic pressing lamination. The ceramic preparation method based on LTCC substrate isostatic pressing lamination comprises the following steps: isostatic pressing lamination: stacking two or more layers of raw ceramic tapes, coating a layer of lamination binder between two adjacent raw ceramic tapes, and then carrying out isostatic pressing lamination at the lamination temperature of 20-50 DEG C under the pressure of 5-20 MPa for 5-20 min; sintering: in a room temperature-first temperature stage, the heating rate is controlled to be 0.3 DEG C/min-0. 6 DEG C/min, and heat preservation is performed for 2-4 hours at the first temperature; in the first temperature-highest temperature stage, the heating rate is 4 DEG C/min-7 DEG C/min, the highest temperature range is 830 DEG C-860 DEG C, and the highest temperature is kept for 10 min-30 min;
本发明提供了一种基于LTCC基片等静压叠层的陶瓷制备方法。所述基于LTCC基片等静压叠层的陶瓷制备方法包括如下步骤:等静压叠层:将两层或多层生瓷带叠放,在相邻两个所述生瓷带之间涂覆一层叠层粘结剂,然后进行等静压叠层,叠层温度20℃‑50℃,压力5MPa‑20MPa,保压时间5min‑20min;烧结:室温‑第一温度阶段:控制升温速率0.3℃/min‑0.6℃/min,第一温度下保温2小时‑4小时;第一温度‑最高温阶段:升温速率4℃/min‑7℃/min,最高温度范围830℃‑860℃,最高温保温10min‑30min。
Ceramic preparation method based on LTCC (Low Temperature Co-Fired Ceramic) substrate isostatic pressing lamination
基于LTCC基片等静压叠层的陶瓷制备方法
HU CHUANDENG (Autor:in) / ZHANG XIANLI (Autor:in) / WANG BIN (Autor:in)
18.10.2022
Patent
Elektronische Ressource
Chinesisch
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