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Ceramic powder for processing copper-clad plate and preparation method thereof
The invention relates to the technical field of functional ceramic materials, and particularly discloses ceramic powder for processing a copper-clad plate and a preparation method thereof, the general formula of the ceramic powder for processing the copper-clad plate is (NaBi) x (LiCe) y (Bi2Nb2O9) z, 0 < = x < = 0.5, 0 < = y < = 0.5, and 0 < = z < = 0.5; the preparation method comprises the following steps: 1) proportioning according to a general formula, and pre-ball-milling to obtain first mixed powder; 2) drying the first mixed powder, and then pre-sintering to obtain pre-sintered powder; 3) performing secondary ball milling on the pre-sintered powder to obtain second mixed powder; 4) sieving the second mixed powder, and then pressing into a biscuit; 5) sintering the pressed biscuit in the step 4), and preserving heat to obtain a ceramic wafer, and 6) covering an electrode with the ceramic wafer, and polarizing the ceramic wafer covered with the electrode to obtain the piezoelectric ceramic prepared from the ceramic powder for processing the copper-clad laminate.The ceramic powder for processing the copper-clad laminate.The ceramic powder for processing the copper-clad laminateprepared by the invention has good high temperature resistance.
本申请涉及功能陶瓷材料技术领域,具体公开了一种用于加工覆铜板的陶瓷粉料及其制备方法,该用于加工覆铜板的陶瓷粉料的通式为(NaBi)x(LiCe)y(Bi2Nb2O9)z,其中,0≤x≤0.5,0≤y≤0.5,0≤z≤0.5;其制备方法包括以下步骤:1)按通式进行配比,预球磨,得到第一混合粉料;2)将第一混合粉料进行烘干,然后进行预烧结,得到预烧粉料;3)将预烧粉料进行二次球磨,得到第二混合粉料;4)将第二混合粉料过筛,然后压制成素坯;5)将4)中压制的素坯进行烧结,保温得到陶瓷片;6)将陶瓷片覆盖电极,将覆盖电极的陶瓷片进行极化,得到用于加工覆铜板的陶瓷粉料制得的压电陶瓷;本申请制得的用于加工覆铜板的陶瓷粉料具有较好的耐高温性能。
Ceramic powder for processing copper-clad plate and preparation method thereof
The invention relates to the technical field of functional ceramic materials, and particularly discloses ceramic powder for processing a copper-clad plate and a preparation method thereof, the general formula of the ceramic powder for processing the copper-clad plate is (NaBi) x (LiCe) y (Bi2Nb2O9) z, 0 < = x < = 0.5, 0 < = y < = 0.5, and 0 < = z < = 0.5; the preparation method comprises the following steps: 1) proportioning according to a general formula, and pre-ball-milling to obtain first mixed powder; 2) drying the first mixed powder, and then pre-sintering to obtain pre-sintered powder; 3) performing secondary ball milling on the pre-sintered powder to obtain second mixed powder; 4) sieving the second mixed powder, and then pressing into a biscuit; 5) sintering the pressed biscuit in the step 4), and preserving heat to obtain a ceramic wafer, and 6) covering an electrode with the ceramic wafer, and polarizing the ceramic wafer covered with the electrode to obtain the piezoelectric ceramic prepared from the ceramic powder for processing the copper-clad laminate.The ceramic powder for processing the copper-clad laminate.The ceramic powder for processing the copper-clad laminateprepared by the invention has good high temperature resistance.
本申请涉及功能陶瓷材料技术领域,具体公开了一种用于加工覆铜板的陶瓷粉料及其制备方法,该用于加工覆铜板的陶瓷粉料的通式为(NaBi)x(LiCe)y(Bi2Nb2O9)z,其中,0≤x≤0.5,0≤y≤0.5,0≤z≤0.5;其制备方法包括以下步骤:1)按通式进行配比,预球磨,得到第一混合粉料;2)将第一混合粉料进行烘干,然后进行预烧结,得到预烧粉料;3)将预烧粉料进行二次球磨,得到第二混合粉料;4)将第二混合粉料过筛,然后压制成素坯;5)将4)中压制的素坯进行烧结,保温得到陶瓷片;6)将陶瓷片覆盖电极,将覆盖电极的陶瓷片进行极化,得到用于加工覆铜板的陶瓷粉料制得的压电陶瓷;本申请制得的用于加工覆铜板的陶瓷粉料具有较好的耐高温性能。
Ceramic powder for processing copper-clad plate and preparation method thereof
一种用于加工覆铜板的陶瓷粉料及其制备方法
ZHANG HAIYAN (Autor:in) / GAO SHAOBING (Autor:in) / LIU CHUANBING (Autor:in) / GUO DAOJIU (Autor:in) / CHEN GANG (Autor:in)
21.10.2022
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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