Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Joined body and electrostatic chuck
The joined body includes a first member having a flat plate shape, a second member having a flat plate shape, and a joining portion disposed between the first member and the second member and joining the first member and the second member, the joining portion having: a first joining layer that is formed of a first joining material and is disposed on the first member side, and a second joining layer that is formed of a second joining material and is disposed on the second member side; a second bonding layer comprising a second bonding material and disposed on the second member side; and a metal layer which is disposed between the first bonding layer and the second bonding layer, has a plurality of holes communicating with each other, and has a flat plate shape. The metal layer is provided with: a first bonding material-impregnated layer which is disposed on the first bonding layer side and in which a first bonding material is impregnated into the plurality of holes; a second bonding material-impregnated layer which is disposed on the second bonding layer side and in which a second bonding material is impregnated into the plurality of holes; and a hollow hole layer which is disposed between the first bonding material-impregnated layer and the second bonding material-impregnated layer and in which the plurality of holes are hollow.
接合体包括平板状的第1构件、平板状的第2构件以及配置于第1构件与第2构件之间并且将第1构件和第2构件接合起来的接合部，接合部具有：第1接合层，其由第1接合材料构成，配置于第1构件侧；第2接合层，其由第2接合材料构成，配置于第2构件侧；以及金属层，其配置于第1接合层与第2接合层之间，形成有彼此连通的多个孔，呈平板状，该金属层具有：配置于第1接合层侧并且第1接合材料浸渗到多个孔中的第1接合材料浸渗层、配置于第2接合层侧并且第2接合材料浸渗到多个孔中的第2接合材料浸渗层以及配置于第1接合材料浸渗层与第2接合材料浸渗层之间并且多个孔为空的空孔层。
Joined body and electrostatic chuck
The joined body includes a first member having a flat plate shape, a second member having a flat plate shape, and a joining portion disposed between the first member and the second member and joining the first member and the second member, the joining portion having: a first joining layer that is formed of a first joining material and is disposed on the first member side, and a second joining layer that is formed of a second joining material and is disposed on the second member side; a second bonding layer comprising a second bonding material and disposed on the second member side; and a metal layer which is disposed between the first bonding layer and the second bonding layer, has a plurality of holes communicating with each other, and has a flat plate shape. The metal layer is provided with: a first bonding material-impregnated layer which is disposed on the first bonding layer side and in which a first bonding material is impregnated into the plurality of holes; a second bonding material-impregnated layer which is disposed on the second bonding layer side and in which a second bonding material is impregnated into the plurality of holes; and a hollow hole layer which is disposed between the first bonding material-impregnated layer and the second bonding material-impregnated layer and in which the plurality of holes are hollow.
接合体包括平板状的第1构件、平板状的第2构件以及配置于第1构件与第2构件之间并且将第1构件和第2构件接合起来的接合部，接合部具有：第1接合层，其由第1接合材料构成，配置于第1构件侧；第2接合层，其由第2接合材料构成，配置于第2构件侧；以及金属层，其配置于第1接合层与第2接合层之间，形成有彼此连通的多个孔，呈平板状，该金属层具有：配置于第1接合层侧并且第1接合材料浸渗到多个孔中的第1接合材料浸渗层、配置于第2接合层侧并且第2接合材料浸渗到多个孔中的第2接合材料浸渗层以及配置于第1接合材料浸渗层与第2接合材料浸渗层之间并且多个孔为空的空孔层。
Joined body and electrostatic chuck
接合体和静电卡盘
ARAKAWA RYUICHI (Autor:in) / TANAKA TOMOO (Autor:in) / YOSHIMOTO OSAMU (Autor:in)
30.12.2022
Patent
Elektronische Ressource
Chinesisch