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JOINED BODY AND ELECTROSTATIC CHUCK
To provide a technology of inhibiting breakage in a joined body.SOLUTION: A joined body is one in which a ceramic member and a composite member are joined together. The composite member includes a plurality of kinds of materials. A difference between a coefficient of thermal expansion of a first material having a minimum coefficient of thermal expansion among the plurality of kinds of materials and a coefficient of thermal expansion of a second material having a maximum coefficient of thermal expansion is 10 ppm/K or more. A particle diameter of a grain composed of the first material which is included in a cross section of the composition member is 50 μm or less.SELECTED DRAWING: Figure 3
【課題】 接合体において、破損を抑制する技術を提供する。【解決手段】 接合体は、セラミック部材と複合部材とが接合されており、複合部材は、複数種類の材料を含んでおり、複数種類の材料のうち、最小の熱膨張係数を有する第1の材料の熱膨張係数と、最大の熱膨張係数を有する第2の材料の熱膨張係数と、の差が、10ppm/K以上であり、複合部材の断面に含まれる、第1の材料からなる粒体の粒径が、50μm以下である。【選択図】 図3
JOINED BODY AND ELECTROSTATIC CHUCK
To provide a technology of inhibiting breakage in a joined body.SOLUTION: A joined body is one in which a ceramic member and a composite member are joined together. The composite member includes a plurality of kinds of materials. A difference between a coefficient of thermal expansion of a first material having a minimum coefficient of thermal expansion among the plurality of kinds of materials and a coefficient of thermal expansion of a second material having a maximum coefficient of thermal expansion is 10 ppm/K or more. A particle diameter of a grain composed of the first material which is included in a cross section of the composition member is 50 μm or less.SELECTED DRAWING: Figure 3
【課題】 接合体において、破損を抑制する技術を提供する。【解決手段】 接合体は、セラミック部材と複合部材とが接合されており、複合部材は、複数種類の材料を含んでおり、複数種類の材料のうち、最小の熱膨張係数を有する第1の材料の熱膨張係数と、最大の熱膨張係数を有する第2の材料の熱膨張係数と、の差が、10ppm/K以上であり、複合部材の断面に含まれる、第1の材料からなる粒体の粒径が、50μm以下である。【選択図】 図3
JOINED BODY AND ELECTROSTATIC CHUCK
接合体、および、静電チャック
YOSHIMOTO OSAMU (Autor:in) / SAKURAI TOSHIYUKI (Autor:in) / YURI SHINJI (Autor:in) / KATSU YUSUKE (Autor:in)
17.10.2024
Patent
Elektronische Ressource
Japanisch