Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Backfill soil compactness on-site measurement device and detection method
The invention relates to the technical field of E02D1/00, in particular to a backfill compactness on-site measuring device and a backfill compactness on-site detecting method. The backfill compactness on-site measuring device comprises a base platform, a guide rod, a heavy hammer and a top block. According to the method, the specific device is combined with a specific backfill compactness calculation method, so that the backfill compactness of the detection point can be quickly obtained on the detection site according to the actually measured drop hammer depth, the workload of interior work is greatly reduced, and the detection efficiency is improved.
本发明涉及E02D1/00技术领域，更具体地，本发明涉及一种回填土密实度现场测定装置以及检测方法。回填土密实度现场测定装置，包括底座平台、导杆、重锤和顶块。本申请中特定装置，结合特定的回填土密实度的计算方法，能够在检测现场依据实测的落锤深度，快速求取检测点回填土密实度，极大降低了内业的工作量，提高了检测效率。
Backfill soil compactness on-site measurement device and detection method
The invention relates to the technical field of E02D1/00, in particular to a backfill compactness on-site measuring device and a backfill compactness on-site detecting method. The backfill compactness on-site measuring device comprises a base platform, a guide rod, a heavy hammer and a top block. According to the method, the specific device is combined with a specific backfill compactness calculation method, so that the backfill compactness of the detection point can be quickly obtained on the detection site according to the actually measured drop hammer depth, the workload of interior work is greatly reduced, and the detection efficiency is improved.
本发明涉及E02D1/00技术领域，更具体地，本发明涉及一种回填土密实度现场测定装置以及检测方法。回填土密实度现场测定装置，包括底座平台、导杆、重锤和顶块。本申请中特定装置，结合特定的回填土密实度的计算方法，能够在检测现场依据实测的落锤深度，快速求取检测点回填土密实度，极大降低了内业的工作量，提高了检测效率。
Backfill soil compactness on-site measurement device and detection method
一种回填土密实度现场测定装置以及检测方法
LOU ZHIHUI (Autor:in) / WAN JIAJIA (Autor:in) / YAN CHANGHONG (Autor:in) / CHEN HAO (Autor:in) / WANG DAPENG (Autor:in) / SUN SHIDING (Autor:in) / YANG XUEFENG (Autor:in) / LI XIAODONG (Autor:in) / DONG SIQI (Autor:in)
24.03.2023
Patent
Elektronische Ressource
Chinesisch
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