Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Composite substrate
One aspect of the present disclosure provides a composite substrate having a ceramic plate and a metal base material bonded to the ceramic plate via a solder layer containing silver and an active metal, the Vickers hardness at a position 20 [mu] m from the ceramic plate toward the metal base material being X, and the Vickers hardness at a position 20 [mu] m from the ceramic plate toward the metal base material being X; when the Vickers hardness at a position of 70 [mu] m from the ceramic plate toward the metal base material is Y, X is 70-110 HV, and the ratio of Y to X is 0.92 or less.
本公开文本的一个方面提供复合基板，其具有陶瓷板和介由钎料层而接合于上述陶瓷板上的金属基材，所述钎料层含有银及活性金属，将从上述陶瓷板起朝向上述金属基材20μm位置处的维氏硬度设为X，将从上述陶瓷板起朝向上述金属基材70μm位置处的维氏硬度设为Y时，上述X为70～110HV，上述Y相对上述X之比为0.92以下。
Composite substrate
One aspect of the present disclosure provides a composite substrate having a ceramic plate and a metal base material bonded to the ceramic plate via a solder layer containing silver and an active metal, the Vickers hardness at a position 20 [mu] m from the ceramic plate toward the metal base material being X, and the Vickers hardness at a position 20 [mu] m from the ceramic plate toward the metal base material being X; when the Vickers hardness at a position of 70 [mu] m from the ceramic plate toward the metal base material is Y, X is 70-110 HV, and the ratio of Y to X is 0.92 or less.
本公开文本的一个方面提供复合基板，其具有陶瓷板和介由钎料层而接合于上述陶瓷板上的金属基材，所述钎料层含有银及活性金属，将从上述陶瓷板起朝向上述金属基材20μm位置处的维氏硬度设为X，将从上述陶瓷板起朝向上述金属基材70μm位置处的维氏硬度设为Y时，上述X为70～110HV，上述Y相对上述X之比为0.92以下。
Composite substrate
复合基板
AONO RYOTA (Autor:in) / TAKEFUJI TAKAYUKI (Autor:in) / USHIJIMA MINORU (Autor:in) / TANAKA JUNICHI (Autor:in)
27.10.2023
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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