Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Composite substrate
One aspect of the present disclosure provides a composite substrate having a ceramic plate, a brazing filler metal layer provided on the ceramic plate, and a metal base material bonded to the ceramic plate via the brazing filler metal layer, the brazing filler metal layer containing silver and tin, the metal base material including a region formed by diffusion of silver and tin, the ratio of Y to X is 0.10-1.00, where X is the thickness of the silver dispersion region and Y is the thickness of the tin dispersion region in a cross section orthogonal to the joining surface of the ceramic plate and the metal substrate.
本公开文本的一个方面提供复合基板，其具有陶瓷板、设置于上述陶瓷板上的钎料层、和介由上述钎料层而与上述陶瓷板接合的金属基材，所述钎料层含有银及锡，所述金属基材包含由银及锡扩散而形成的区域，将与上述陶瓷板和上述金属基材的接合面正交的截面中的、银分散区域的厚度设为X，将锡分散区域的厚度设为Y时，上述Y相对上述X之比为0.10～1.00。
Composite substrate
One aspect of the present disclosure provides a composite substrate having a ceramic plate, a brazing filler metal layer provided on the ceramic plate, and a metal base material bonded to the ceramic plate via the brazing filler metal layer, the brazing filler metal layer containing silver and tin, the metal base material including a region formed by diffusion of silver and tin, the ratio of Y to X is 0.10-1.00, where X is the thickness of the silver dispersion region and Y is the thickness of the tin dispersion region in a cross section orthogonal to the joining surface of the ceramic plate and the metal substrate.
本公开文本的一个方面提供复合基板，其具有陶瓷板、设置于上述陶瓷板上的钎料层、和介由上述钎料层而与上述陶瓷板接合的金属基材，所述钎料层含有银及锡，所述金属基材包含由银及锡扩散而形成的区域，将与上述陶瓷板和上述金属基材的接合面正交的截面中的、银分散区域的厚度设为X，将锡分散区域的厚度设为Y时，上述Y相对上述X之比为0.10～1.00。
Composite substrate
复合基板
AONO RYOTA (Autor:in) / TAKEFUJI TAKAYUKI (Autor:in) / USHIJIMA MINORU (Autor:in) / TANAKA JUNICHI (Autor:in)
03.11.2023
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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