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Locking guide structure
The invention provides a locking guide structure which is suitable for a semiconductor carrier door. The locking guide structure comprises an upper latch part, a lower latch part, at least one elastic component and a driving component. The first guide part of the upper latch part and the second guide part of the lower latch part are arranged in a matched mode and define a containing space used for containing the elastic assembly. The driving assembly is used for synchronously driving the upper linkage piece of the first guiding part and the lower linkage piece of the second guiding part to move linearly in the reverse direction, and the elastic assembly presents the corresponding elastic compression or release degree according to the linear movement amplitude between the upper linkage piece and the lower linkage piece. Therefore, the upper latch part and the lower latch part are controlled to be in an opening state or a locking state.
本发明提出一种锁附导正结构,适用于半导体载具门。该锁附导正结构包括上闩锁部、下闩锁部、至少一弹性组件以及一驱动组件。上闩锁部的第一导正部与下闩锁部的第二导正部为匹配设置,并界定出用以容置弹性组件的容置空间。驱动组件用以同步驱动第一导正部的上连动件与第二导正部的下连动件以反向线性移动,弹性组件根据上连动件与下连动件之间的线性移动幅度呈现相应的弹性压缩或释放程度,据以控制上闩锁部与下闩锁部呈现开启状态或闭锁状态。
Locking guide structure
The invention provides a locking guide structure which is suitable for a semiconductor carrier door. The locking guide structure comprises an upper latch part, a lower latch part, at least one elastic component and a driving component. The first guide part of the upper latch part and the second guide part of the lower latch part are arranged in a matched mode and define a containing space used for containing the elastic assembly. The driving assembly is used for synchronously driving the upper linkage piece of the first guiding part and the lower linkage piece of the second guiding part to move linearly in the reverse direction, and the elastic assembly presents the corresponding elastic compression or release degree according to the linear movement amplitude between the upper linkage piece and the lower linkage piece. Therefore, the upper latch part and the lower latch part are controlled to be in an opening state or a locking state.
本发明提出一种锁附导正结构,适用于半导体载具门。该锁附导正结构包括上闩锁部、下闩锁部、至少一弹性组件以及一驱动组件。上闩锁部的第一导正部与下闩锁部的第二导正部为匹配设置,并界定出用以容置弹性组件的容置空间。驱动组件用以同步驱动第一导正部的上连动件与第二导正部的下连动件以反向线性移动,弹性组件根据上连动件与下连动件之间的线性移动幅度呈现相应的弹性压缩或释放程度,据以控制上闩锁部与下闩锁部呈现开启状态或闭锁状态。
Locking guide structure
锁附导正结构
QIU MINGQIAN (Autor:in) / LIN ZHIMING (Autor:in) / ZHOU ZHENGHAN (Autor:in) / LI BAITING (Autor:in)
29.03.2024
Patent
Elektronische Ressource
Chinesisch