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Low-dielectric low-loss LTCC (Low Temperature Co-Fired Ceramic) material as well as preparation method and raw ceramic tape thereof
The invention relates to a low-dielectric low-loss LTCC material, a preparation method thereof and a green tape, the low-dielectric low-loss LTCC material is prepared by mixing a ceramic filling phase and a glass low-sintering aid, the ceramic filling phase is lanthanum borosilicate microwave dielectric ceramic LaBSiO5, and the glass low-sintering aid is La2O3-B2O3 glass. According to the low-dielectric low-loss LTCC material disclosed by the invention, the lanthanum borosilicate microwave dielectric ceramic which has the characteristics of low dielectric constant and low loss and is relatively low in sintering temperature (less than 1200 DEG C) is taken as a ceramic filling phase, and the La2O3-B2O3 glass is taken as a glass low-sintering aid, so that the loss of a ceramic glass system is reduced, the sintering temperature of the low-dielectric low-loss LTCC material is reduced, and the sintering temperature of the low-dielectric low-loss LTCC material is reduced. The LaBSiO5 series material can be sintered in a temperature range lower than 900 DEG C, and has excellent microwave dielectric properties, so that an LTCC substrate material prepared from the LTCC green tape has a relatively low dielectric constant and dielectric loss.
本发明涉及一种低介低损耗LTCC材料及其制备方法和生瓷带,所述低介低损耗LTCC材料由陶瓷填充相和玻璃低烧助剂混合制备而成,其中,所述陶瓷填充相为镧硼硅酸盐系微波介质陶瓷LaBSiO5,所述玻璃低烧助剂为La2O3‑B2O3玻璃。本发明低介低损耗LTCC材料以具有低介低损耗特性且烧结温度较低(<1200℃)的镧硼硅酸盐系微波介质陶瓷为陶瓷填充相,以La2O3‑B2O3玻璃为玻璃低烧助剂,降低了陶瓷玻璃体系的损耗,降低了低介低损耗LTCC材料的烧结温度,使得LaBSiO5系材料能够在低于900℃的温度范围内烧结,且具有优异的微波介电性能,使得采用LTCC生瓷带制备成的LTCC基板材料具有较低的介电常数和介电损耗。
Low-dielectric low-loss LTCC (Low Temperature Co-Fired Ceramic) material as well as preparation method and raw ceramic tape thereof
The invention relates to a low-dielectric low-loss LTCC material, a preparation method thereof and a green tape, the low-dielectric low-loss LTCC material is prepared by mixing a ceramic filling phase and a glass low-sintering aid, the ceramic filling phase is lanthanum borosilicate microwave dielectric ceramic LaBSiO5, and the glass low-sintering aid is La2O3-B2O3 glass. According to the low-dielectric low-loss LTCC material disclosed by the invention, the lanthanum borosilicate microwave dielectric ceramic which has the characteristics of low dielectric constant and low loss and is relatively low in sintering temperature (less than 1200 DEG C) is taken as a ceramic filling phase, and the La2O3-B2O3 glass is taken as a glass low-sintering aid, so that the loss of a ceramic glass system is reduced, the sintering temperature of the low-dielectric low-loss LTCC material is reduced, and the sintering temperature of the low-dielectric low-loss LTCC material is reduced. The LaBSiO5 series material can be sintered in a temperature range lower than 900 DEG C, and has excellent microwave dielectric properties, so that an LTCC substrate material prepared from the LTCC green tape has a relatively low dielectric constant and dielectric loss.
本发明涉及一种低介低损耗LTCC材料及其制备方法和生瓷带,所述低介低损耗LTCC材料由陶瓷填充相和玻璃低烧助剂混合制备而成,其中,所述陶瓷填充相为镧硼硅酸盐系微波介质陶瓷LaBSiO5,所述玻璃低烧助剂为La2O3‑B2O3玻璃。本发明低介低损耗LTCC材料以具有低介低损耗特性且烧结温度较低(<1200℃)的镧硼硅酸盐系微波介质陶瓷为陶瓷填充相,以La2O3‑B2O3玻璃为玻璃低烧助剂,降低了陶瓷玻璃体系的损耗,降低了低介低损耗LTCC材料的烧结温度,使得LaBSiO5系材料能够在低于900℃的温度范围内烧结,且具有优异的微波介电性能,使得采用LTCC生瓷带制备成的LTCC基板材料具有较低的介电常数和介电损耗。
Low-dielectric low-loss LTCC (Low Temperature Co-Fired Ceramic) material as well as preparation method and raw ceramic tape thereof
一种低介低损耗LTCC材料及其制备方法和生瓷带
LYU YANG (Autor:in) / LAN YAOHAI (Autor:in) / WANG MINGMING (Autor:in) / WEI QIPENG (Autor:in) / WANG FEI (Autor:in) / MA TAO (Autor:in)
12.04.2024
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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