Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Probe card adapter plate manufacturing method
The invention discloses a manufacturing method of a probe card adapter plate, the probe card adapter plate is provided with a main body structure formed by stacking n ceramic layers, n is greater than or equal to 1, and the method comprises the following specific steps: preparing a photocuring ceramic slurry material, 3D printing equipment and a design layout of each layer of the probe card adapter plate to be printed; printing, wherein the ceramic layers are printed layer by layer through 3D printing equipment and subjected to light curing; the ceramic layer is filled with conductive slurry, so that a non-photocuring area in the layer is filled with the conductive slurry; and the printing and filling steps are circulated and repeated until all the ceramic layers are manufactured. And on the premise of ensuring that the structural strength reaches the standard, deformation caused by calcination is avoided, and the effects of improving the production efficiency and improving the product quality are achieved.
本发明公开了一种探针卡转接板的制作方法，探针卡转接板具有由n层陶瓷层堆叠而成的主体结构，其中n≥1，具体步骤包括：准备，光固化陶瓷浆液材料、3D打印设备以及待打印的探针卡转接板各层的设计版图；打印，通过3D打印设备逐层打印并光固化各陶瓷层；填料，向陶瓷层内填充导电浆料，使层内的非光固化区域填充满导电浆料；循环，重复打印和填料步骤，直至所有陶瓷层制作完毕。保证结构强度达标的前提下，避免煅烧带来的形变，实现提高生产效率，提升产品质量效果。
Probe card adapter plate manufacturing method
The invention discloses a manufacturing method of a probe card adapter plate, the probe card adapter plate is provided with a main body structure formed by stacking n ceramic layers, n is greater than or equal to 1, and the method comprises the following specific steps: preparing a photocuring ceramic slurry material, 3D printing equipment and a design layout of each layer of the probe card adapter plate to be printed; printing, wherein the ceramic layers are printed layer by layer through 3D printing equipment and subjected to light curing; the ceramic layer is filled with conductive slurry, so that a non-photocuring area in the layer is filled with the conductive slurry; and the printing and filling steps are circulated and repeated until all the ceramic layers are manufactured. And on the premise of ensuring that the structural strength reaches the standard, deformation caused by calcination is avoided, and the effects of improving the production efficiency and improving the product quality are achieved.
本发明公开了一种探针卡转接板的制作方法，探针卡转接板具有由n层陶瓷层堆叠而成的主体结构，其中n≥1，具体步骤包括：准备，光固化陶瓷浆液材料、3D打印设备以及待打印的探针卡转接板各层的设计版图；打印，通过3D打印设备逐层打印并光固化各陶瓷层；填料，向陶瓷层内填充导电浆料，使层内的非光固化区域填充满导电浆料；循环，重复打印和填料步骤，直至所有陶瓷层制作完毕。保证结构强度达标的前提下，避免煅烧带来的形变，实现提高生产效率，提升产品质量效果。
Probe card adapter plate manufacturing method
一种探针卡转接板的制作方法
SHAO YU (Autor:in) / HOU KEYU (Autor:in) / YU HAICHAO (Autor:in)
19.04.2024
Patent
Elektronische Ressource
Chinesisch
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