Cermet substrate and method for manufacturing cermet substrate: Fid-Bau Portal

Cermet substrate and method for manufacturing cermet substrate

MEYER ANDREAS

The invention relates to a cermet substrate (1), which is provided as a circuit board for fastening an electrical component, comprising:-a component metallization (10) and a rear metallization (20); and-a ceramic element (30) which is arranged between the component metallization (10) and the rear metallization (20) in the stacking direction (S), the component metallization (10) having a first metal section (11) and a second metal section (12), the first metal section (11) and the second metal section (12) being separated from one another by an insulating section (15), the rear metallization (20) has a metal weakness (25), in particular a metal recess, which is arranged congruently to the insulating section (15) when viewed in the stacking direction (S).

本发明涉及一种金属陶瓷基板(1)，所述金属陶瓷基板设为用于固定电器件的电路板，包括：‑器件金属化部(10)和后侧金属化部(20)；和‑陶瓷元件(30)，所述陶瓷元件沿着堆叠方向(S)在器件金属化部(10)和后侧金属化部(20)之间设置，其中器件金属化部(10)具有第一金属部段(11)和第二金属部段(12)，其中第一金属部段(11)和第二金属部段(12)通过绝缘部段(15)彼此分离，并且其中后侧金属化部(20)具有金属薄弱部(25)，尤其金属留空部，所述金属薄弱部沿堆叠方向(S)观察与绝缘部段(15)全等地设置。

Zugriff

Download

Seitennavigation

Dokumentinformationen

Ähnliche Titel

Exportieren, teilen und zitieren