Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Microwave sintering method of multilayer ceramic circuit substrate
The invention relates to the technical field of sintering of ceramic electronic components, in particular to a microwave sintering method of a multilayer ceramic circuit substrate. A load bearing plate, a multilayer ceramic circuit substrate blank body and a pressing plate are sequentially placed in a heat preservation device; then putting the heat preservation device into a microwave oven, and carrying out glue discharging and sintering in sequence to obtain a multilayer ceramic circuit substrate; wherein the load bearing plate and the pressing plate are made of chromium oxide and zirconium oxide composite ceramics. In the glue discharging and sintering process, the burning bearing plate and the pressing plate absorb microwaves and heat by themselves, uniform heating and rapid temperature rising of the multi-layer ceramic circuit substrate blank are achieved, the sintering period is shortened, and sintering energy consumption is reduced.
本发明涉及陶瓷电子元器件烧结技术领域，尤其涉及一种多层陶瓷电路基板的微波烧结方法。本发明在保温装置中顺次放置承烧板、多层陶瓷电路基板胚体和压板；随后将保温装置放入微波加热炉中顺次进行排胶、烧结，得到多层陶瓷电路基板；其中承烧板及压板为氧化铬和氧化锆复合陶瓷。在排胶和烧结过程中，承烧板和压板吸收微波，自身发热，实现多层陶瓷电路基板胚体的均匀加热及快速升温，缩短烧结周期，降低烧结能耗。
Microwave sintering method of multilayer ceramic circuit substrate
The invention relates to the technical field of sintering of ceramic electronic components, in particular to a microwave sintering method of a multilayer ceramic circuit substrate. A load bearing plate, a multilayer ceramic circuit substrate blank body and a pressing plate are sequentially placed in a heat preservation device; then putting the heat preservation device into a microwave oven, and carrying out glue discharging and sintering in sequence to obtain a multilayer ceramic circuit substrate; wherein the load bearing plate and the pressing plate are made of chromium oxide and zirconium oxide composite ceramics. In the glue discharging and sintering process, the burning bearing plate and the pressing plate absorb microwaves and heat by themselves, uniform heating and rapid temperature rising of the multi-layer ceramic circuit substrate blank are achieved, the sintering period is shortened, and sintering energy consumption is reduced.
本发明涉及陶瓷电子元器件烧结技术领域，尤其涉及一种多层陶瓷电路基板的微波烧结方法。本发明在保温装置中顺次放置承烧板、多层陶瓷电路基板胚体和压板；随后将保温装置放入微波加热炉中顺次进行排胶、烧结，得到多层陶瓷电路基板；其中承烧板及压板为氧化铬和氧化锆复合陶瓷。在排胶和烧结过程中，承烧板和压板吸收微波，自身发热，实现多层陶瓷电路基板胚体的均匀加热及快速升温，缩短烧结周期，降低烧结能耗。
Microwave sintering method of multilayer ceramic circuit substrate
一种多层陶瓷电路基板的微波烧结方法
ZHANG RUI (Autor:in) / FAN BINGBING (Autor:in) / CHEN YONGQIANG (Autor:in) / LIU YONGLIANG (Autor:in) / WANG HAILONG (Autor:in) / SHAO GANG (Autor:in) / LUO LING (Autor:in) / WANG JIASHUAI (Autor:in) / ZHOU BINGYU (Autor:in) / ZHAO QIUJU (Autor:in)
04.06.2024
Patent
Elektronische Ressource
Chinesisch
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