Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Sintering method of high-reliability multilayer co-fired ceramic circuit substrate
The invention discloses a sintering method of a high-reliability multilayer co-fired ceramic circuit substrate, and belongs to the field of electronic components. Comprising the following steps: (1) placing one or more circuit substrates to be burnt on a load bearing plate with a smooth and clean surface; (2) carbon blocks with set heights are placed at the four corners of the burning bearing plate and the gap positions between the circuit substrates to be burnt; (3) placing a pressing plate with a set thickness on the carbon block; (4) stacking layer by layer according to the methods in the steps (1)-(3) by adopting a batch stacking device; (5) the stacked products are placed in a grate furnace to be subjected to glue discharging; and (6) after glue discharging is finished, the product is sintered according to a set sintering process. The problems that in the sintering process of an existing multi-layer co-fired ceramic circuit substrate, the substrate is prone to deformation and warping, adhesive discharging and carbon residue exist, so that the substrate is poor in strength and dielectric property, and air leakage exists in substrate sealing and even the substrate cannot be used are solved. The method is widely applied to the circuit substrate sintering technology in the field of high-power micro-assembly circuits.
一种高可靠多层共烧陶瓷电路基板的烧结方法，本发明属于电子元器件领域。包括如下步骤：(1)将一个或一个以上待烧电路基板放在表面光滑、洁净的承烧板上；(2)将设定高度的碳块放在承烧板的四个角以及待烧电路基板之间的间隙位置；(3)将设定厚度的压板放置在碳块上；(4)采用批量化堆烧装置按步骤(1)～(3)的方法逐层堆叠；(5)将堆叠好的产品置于排炉中进行排胶；(6)待排胶结束后，再将产品按设定的烧结工艺进行烧结。解决了现有多层共烧陶瓷电路基板在烧结过程中基板易变形、翘曲、有排胶残碳，导致基板强度差、介电性能差、基板密封存在漏气甚至无法使用的问题。广泛应用于大功率微组装电路领域用的电路基板烧结技术中。
Sintering method of high-reliability multilayer co-fired ceramic circuit substrate
The invention discloses a sintering method of a high-reliability multilayer co-fired ceramic circuit substrate, and belongs to the field of electronic components. Comprising the following steps: (1) placing one or more circuit substrates to be burnt on a load bearing plate with a smooth and clean surface; (2) carbon blocks with set heights are placed at the four corners of the burning bearing plate and the gap positions between the circuit substrates to be burnt; (3) placing a pressing plate with a set thickness on the carbon block; (4) stacking layer by layer according to the methods in the steps (1)-(3) by adopting a batch stacking device; (5) the stacked products are placed in a grate furnace to be subjected to glue discharging; and (6) after glue discharging is finished, the product is sintered according to a set sintering process. The problems that in the sintering process of an existing multi-layer co-fired ceramic circuit substrate, the substrate is prone to deformation and warping, adhesive discharging and carbon residue exist, so that the substrate is poor in strength and dielectric property, and air leakage exists in substrate sealing and even the substrate cannot be used are solved. The method is widely applied to the circuit substrate sintering technology in the field of high-power micro-assembly circuits.
一种高可靠多层共烧陶瓷电路基板的烧结方法，本发明属于电子元器件领域。包括如下步骤：(1)将一个或一个以上待烧电路基板放在表面光滑、洁净的承烧板上；(2)将设定高度的碳块放在承烧板的四个角以及待烧电路基板之间的间隙位置；(3)将设定厚度的压板放置在碳块上；(4)采用批量化堆烧装置按步骤(1)～(3)的方法逐层堆叠；(5)将堆叠好的产品置于排炉中进行排胶；(6)待排胶结束后，再将产品按设定的烧结工艺进行烧结。解决了现有多层共烧陶瓷电路基板在烧结过程中基板易变形、翘曲、有排胶残碳，导致基板强度差、介电性能差、基板密封存在漏气甚至无法使用的问题。广泛应用于大功率微组装电路领域用的电路基板烧结技术中。
Sintering method of high-reliability multilayer co-fired ceramic circuit substrate
一种高可靠多层共烧陶瓷电路基板的烧结方法
SHU GUOJIN (Autor:in) / PANG JINBIAO (Autor:in) / DOU ZHANMING (Autor:in) / YUAN SHIFENG (Autor:in) / LIU KAI (Autor:in) / SHEN YITING (Autor:in) / HAN YUCHENG (Autor:in)
28.02.2023
Patent
Elektronische Ressource
Chinesisch
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