Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
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High-entropy compound thermoelectric material and preparation method thereof
The invention provides a high-entropy compound thermoelectric material. The high-entropy compound thermoelectric material has a chemical formula as shown in a formula I: AgSbPbSnGeTe5 + x% Cu2Te as shown in a formula (1), wherein 0 < = x < = 11. The high-entropy compound thermoelectric material provided by the invention is good in crystallinity and has a typical face-centered cubic crystal structure. The six elements of Ag, Sb, Pb, Sn, Ge and Te are uniformly distributed and are similar to the chemical formula in proportion. The high-entropy AgSbPbSnGeTe5 thermoelectric material has high conductivity and low lattice thermal conductivity, the thermoelectric figure of merit of the high-entropy AgSbPbSnGeTe5 thermoelectric material can reach 1.22 at the temperature of 673K, the average thermoelectric figure of merit of the high-entropy AgSbPbSnGeTe5 thermoelectric material can reach 0.81 within the temperature range from room temperature to 673K, and the high-entropy AgSbPbSnGeTe5 thermoelectric material is a novel thermoelectric material with considerable thermoelectric performance near the medium temperature. And through a carrier optimization means, after solid solution with a small amount of Cu2Te, the thermoelectric figure of merit can reach 1.75 at the temperature of 723K.
本发明提供了一种高熵化合物热电材料，具有式Ⅰ所示化学式：AgSbPbSnGeTe5+x％Cu2Te式(1)；其中，0≤x≤11。本发明提供的上述高熵化合物热电材料结晶性良好，具有典型面心立方晶体结构。Ag，Sb，Pb，Sn，Ge，Te六种元素分布均匀且与化学式比例相近。其具备较高的电导率和较低的晶格热导率，其中高熵AgSbPbSnGeTe5热电优值可在673K温度下可达到1.22，在室温到673K温度范围内，其平均热电优值可到达0.81，是在中温附近具备可观热电性能的新型热电材料。并且通过载流子优化手段，与少量Cu2Te固溶后，其热电优值在723K温度下可达到1.75。
High-entropy compound thermoelectric material and preparation method thereof
The invention provides a high-entropy compound thermoelectric material. The high-entropy compound thermoelectric material has a chemical formula as shown in a formula I: AgSbPbSnGeTe5 + x% Cu2Te as shown in a formula (1), wherein 0 < = x < = 11. The high-entropy compound thermoelectric material provided by the invention is good in crystallinity and has a typical face-centered cubic crystal structure. The six elements of Ag, Sb, Pb, Sn, Ge and Te are uniformly distributed and are similar to the chemical formula in proportion. The high-entropy AgSbPbSnGeTe5 thermoelectric material has high conductivity and low lattice thermal conductivity, the thermoelectric figure of merit of the high-entropy AgSbPbSnGeTe5 thermoelectric material can reach 1.22 at the temperature of 673K, the average thermoelectric figure of merit of the high-entropy AgSbPbSnGeTe5 thermoelectric material can reach 0.81 within the temperature range from room temperature to 673K, and the high-entropy AgSbPbSnGeTe5 thermoelectric material is a novel thermoelectric material with considerable thermoelectric performance near the medium temperature. And through a carrier optimization means, after solid solution with a small amount of Cu2Te, the thermoelectric figure of merit can reach 1.75 at the temperature of 723K.
本发明提供了一种高熵化合物热电材料，具有式Ⅰ所示化学式：AgSbPbSnGeTe5+x％Cu2Te式(1)；其中，0≤x≤11。本发明提供的上述高熵化合物热电材料结晶性良好，具有典型面心立方晶体结构。Ag，Sb，Pb，Sn，Ge，Te六种元素分布均匀且与化学式比例相近。其具备较高的电导率和较低的晶格热导率，其中高熵AgSbPbSnGeTe5热电优值可在673K温度下可达到1.22，在室温到673K温度范围内，其平均热电优值可到达0.81，是在中温附近具备可观热电性能的新型热电材料。并且通过载流子优化手段，与少量Cu2Te固溶后，其热电优值在723K温度下可达到1.75。
High-entropy compound thermoelectric material and preparation method thereof
一种高熵化合物热电材料及其制备方法
XIAO CHONG (Autor:in) / LI KAI (Autor:in) / XIE YI (Autor:in)
03.09.2024
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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