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Preparation process of ceramic substrate capable of reducing generation of pinholes and ceramic substrate
The invention discloses a preparation technology of a ceramic substrate capable of reducing generation of pinholes and the ceramic substrate, and belongs to the technical field of ceramic substrate preparation technologies. The ceramic substrate is prepared through the steps of slurry preparation, biscuit forming and sintering, alumina powder with the purity larger than or equal to 99.9% is selected as a raw material, and the content of flammable impurities and volatile impurities in the raw material is reduced; the method comprises the following steps of: reducing the occurrence of pinholes in the ceramic substrate due to gas generated by excessive combustible gas and volatile impurities in the sintering process, controlling the sum of the heating rate in the sintering process to be 0.1 DEG C/min-0. 5 DEG C/min, promoting the overflow of the gas so as to reduce the generation of pinholes in the finished ceramic substrate, controlling the cooling rate in the sintering process to be 0.1 DEG C/min-0. 5 DEG C/min, and reducing the generation of the pinholes in the finished ceramic substrate. And closed bubbles collapse in time so as to reduce pinholes in the finished ceramic substrate.
本发明公开了一种减少针孔产生的陶瓷基板的制备工艺及陶瓷基板,属于陶瓷基板制备工艺技术领域。发明通过制备浆料、素坯成型、烧结步骤制备得到陶瓷基板,选择纯度≥99.9%的氧化铝粉作为原材料,减少原材料中可燃性杂质和可挥发性杂质的含量,降低在烧结过程中因为可燃性气体和可挥发性杂质含量过多产生气体导致陶瓷基板出现针孔,同时控制烧结过程中的升温速率和为0.1℃/min~0.5℃/min,促进气体的溢出以减少成品陶瓷基板中针孔的产生,控制烧结过程中的降温速率为0.1℃/min~0.5℃/min,使封闭气泡及时坍塌以减少成品陶瓷基板中针孔的产生。
Preparation process of ceramic substrate capable of reducing generation of pinholes and ceramic substrate
The invention discloses a preparation technology of a ceramic substrate capable of reducing generation of pinholes and the ceramic substrate, and belongs to the technical field of ceramic substrate preparation technologies. The ceramic substrate is prepared through the steps of slurry preparation, biscuit forming and sintering, alumina powder with the purity larger than or equal to 99.9% is selected as a raw material, and the content of flammable impurities and volatile impurities in the raw material is reduced; the method comprises the following steps of: reducing the occurrence of pinholes in the ceramic substrate due to gas generated by excessive combustible gas and volatile impurities in the sintering process, controlling the sum of the heating rate in the sintering process to be 0.1 DEG C/min-0. 5 DEG C/min, promoting the overflow of the gas so as to reduce the generation of pinholes in the finished ceramic substrate, controlling the cooling rate in the sintering process to be 0.1 DEG C/min-0. 5 DEG C/min, and reducing the generation of the pinholes in the finished ceramic substrate. And closed bubbles collapse in time so as to reduce pinholes in the finished ceramic substrate.
本发明公开了一种减少针孔产生的陶瓷基板的制备工艺及陶瓷基板,属于陶瓷基板制备工艺技术领域。发明通过制备浆料、素坯成型、烧结步骤制备得到陶瓷基板,选择纯度≥99.9%的氧化铝粉作为原材料,减少原材料中可燃性杂质和可挥发性杂质的含量,降低在烧结过程中因为可燃性气体和可挥发性杂质含量过多产生气体导致陶瓷基板出现针孔,同时控制烧结过程中的升温速率和为0.1℃/min~0.5℃/min,促进气体的溢出以减少成品陶瓷基板中针孔的产生,控制烧结过程中的降温速率为0.1℃/min~0.5℃/min,使封闭气泡及时坍塌以减少成品陶瓷基板中针孔的产生。
Preparation process of ceramic substrate capable of reducing generation of pinholes and ceramic substrate
一种减少针孔产生的陶瓷基板的制备工艺及陶瓷基板
HU CHUANDENG (Autor:in) / LI SHANSHAN (Autor:in)
22.11.2024
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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