Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The invention relates to the technical field of ceramic substrate preparation, in particular to a ceramic substrate preparation process which comprises the following steps: S1, preparing an organic framework; s2, preparing ceramic slurry; s3, preparing a porous ceramic substrate; s4, a copper infiltration process; s5, spraying ceramic powder; and S6, final treatment. In the preparation process of the ceramic substrate, the overall performance of the ceramic substrate is remarkably improved by combining a plurality of innovative steps of a 3D printing technology, ceramic slurry preparation, porous ceramic substrate forming, a copper infiltration process, ceramic powder spraying and the like. And the organic framework is accurately manufactured by utilizing a 3D printing technology, so that the accuracy and the consistency of the internal structure of the substrate are ensured. And secondly, by optimizing the formula and the mixing process of the ceramic slurry, the ceramic substrate is more uniform in the forming process, and internal defects are reduced, so that the mechanical strength and the toughness of the substrate are improved. A copper infiltration process is adopted, copper is infiltrated into the porous ceramic substrate, and the comprehensive performance of the substrate is effectively improved.
本发明涉及陶瓷基板制备技术领域，具体为一种陶瓷基板制备工艺，包括如下步骤：S1、有机骨架制备；S2、陶瓷浆料制备；S3、多孔陶瓷基板制备；S4、渗铜工艺；S5、陶瓷粉喷涂；S6、最终处理。该陶瓷基板制备工艺中，通过结合3D打印技术、陶瓷浆料制备、多孔陶瓷基板成型、渗铜工艺以及陶瓷粉喷涂等多个创新步骤，显著提升了陶瓷基板的整体性能。利用3D打印技术精确制造有机骨架，确保了基板内部结构的精准性和一致性。其次，通过优化陶瓷浆料的配方和混合工艺，使得陶瓷基板在成型过程中更加均匀，减少了内部缺陷，从而提高了基板的机械强度和韧性。本发明采用了渗铜工艺，在多孔陶瓷基板中渗入铜，有效提升了基板的综合性能。
The invention relates to the technical field of ceramic substrate preparation, in particular to a ceramic substrate preparation process which comprises the following steps: S1, preparing an organic framework; s2, preparing ceramic slurry; s3, preparing a porous ceramic substrate; s4, a copper infiltration process; s5, spraying ceramic powder; and S6, final treatment. In the preparation process of the ceramic substrate, the overall performance of the ceramic substrate is remarkably improved by combining a plurality of innovative steps of a 3D printing technology, ceramic slurry preparation, porous ceramic substrate forming, a copper infiltration process, ceramic powder spraying and the like. And the organic framework is accurately manufactured by utilizing a 3D printing technology, so that the accuracy and the consistency of the internal structure of the substrate are ensured. And secondly, by optimizing the formula and the mixing process of the ceramic slurry, the ceramic substrate is more uniform in the forming process, and internal defects are reduced, so that the mechanical strength and the toughness of the substrate are improved. A copper infiltration process is adopted, copper is infiltrated into the porous ceramic substrate, and the comprehensive performance of the substrate is effectively improved.
本发明涉及陶瓷基板制备技术领域，具体为一种陶瓷基板制备工艺，包括如下步骤：S1、有机骨架制备；S2、陶瓷浆料制备；S3、多孔陶瓷基板制备；S4、渗铜工艺；S5、陶瓷粉喷涂；S6、最终处理。该陶瓷基板制备工艺中，通过结合3D打印技术、陶瓷浆料制备、多孔陶瓷基板成型、渗铜工艺以及陶瓷粉喷涂等多个创新步骤，显著提升了陶瓷基板的整体性能。利用3D打印技术精确制造有机骨架，确保了基板内部结构的精准性和一致性。其次，通过优化陶瓷浆料的配方和混合工艺，使得陶瓷基板在成型过程中更加均匀，减少了内部缺陷，从而提高了基板的机械强度和韧性。本发明采用了渗铜工艺，在多孔陶瓷基板中渗入铜，有效提升了基板的综合性能。
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