Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Ceramic packaging base and manufacturing method thereof
The invention discloses a ceramic packaging base and a manufacturing method thereof, and belongs to the technical field of electronic components, the ceramic packaging base comprises a ceramic layer and a conductive layer, the ceramic layer and the conductive layer are adjacently arranged, the raw material of the ceramic layer comprises ceramic slurry, and the ceramic slurry comprises the following components: modified powder A, trimethylolpropane triacrylate A, 1, 2, 4-trimethyl-1, 3-pentanediol monoisobutyrate A, 1, 3, 4-pentanediol monoisobutyrate B, 1, 3, 4-pentanediol monoisobutyrate B and a solvent. The photoinitiator is prepared from 1, 6-hexanediol diacrylate A, a photoinitiator A and sodium polyacrylate A, in the invention, the sebacic acid can modify the surface potential of the alumina powder, and a part of carboxyl groups can form coordinate bonds or ionic bonds with atoms or ions on the surface of the alumina powder, so that the surface energy of the alumina powder can be reduced, the internal friction of the ceramic slurry subsequently prepared by taking the modified powder as the raw material is small, and the viscosity of the ceramic slurry is reduced; the other part of carboxyl is bridged on the surface of the aluminum oxide powder by forming hydrogen bonds, so that the potential of the surface of the aluminum oxide powder is changed, and the contact collision between the aluminum oxide powder is reduced due to mutual repulsion of the same charges.
本发明公开了一种陶瓷封装基座及其制作方法，属于电子元件技术领域，包括陶瓷层和导电层，所述陶瓷层和导电层相邻设置，所述陶瓷层的原料包括陶瓷浆料，所述陶瓷浆料包括以下组分：改性粉体A、三羟甲基丙烷三丙烯酸酯A、1，6‑己二醇二丙烯酸酯A、光引发剂A和聚丙烯酸钠A。本发明中，癸二酸能够对氧化铝粉体表面电位进行修饰，其中一部分羧基会与氧化铝粉体表面原子或离子形成配位键或离子键，因而能够降低氧化铝粉体表面能，以改性粉体为原料后续制作的陶瓷浆料内摩擦小，降低了陶瓷浆料的黏度，另一部分羧基则通过形成氢键的方式桥接在氧化铝粉体表面，改变了氧化铝粉体表面的电位，氧化铝粉体之间由于同种电荷相互排斥而减少了接触碰撞。
Ceramic packaging base and manufacturing method thereof
The invention discloses a ceramic packaging base and a manufacturing method thereof, and belongs to the technical field of electronic components, the ceramic packaging base comprises a ceramic layer and a conductive layer, the ceramic layer and the conductive layer are adjacently arranged, the raw material of the ceramic layer comprises ceramic slurry, and the ceramic slurry comprises the following components: modified powder A, trimethylolpropane triacrylate A, 1, 2, 4-trimethyl-1, 3-pentanediol monoisobutyrate A, 1, 3, 4-pentanediol monoisobutyrate B, 1, 3, 4-pentanediol monoisobutyrate B and a solvent. The photoinitiator is prepared from 1, 6-hexanediol diacrylate A, a photoinitiator A and sodium polyacrylate A, in the invention, the sebacic acid can modify the surface potential of the alumina powder, and a part of carboxyl groups can form coordinate bonds or ionic bonds with atoms or ions on the surface of the alumina powder, so that the surface energy of the alumina powder can be reduced, the internal friction of the ceramic slurry subsequently prepared by taking the modified powder as the raw material is small, and the viscosity of the ceramic slurry is reduced; the other part of carboxyl is bridged on the surface of the aluminum oxide powder by forming hydrogen bonds, so that the potential of the surface of the aluminum oxide powder is changed, and the contact collision between the aluminum oxide powder is reduced due to mutual repulsion of the same charges.
本发明公开了一种陶瓷封装基座及其制作方法，属于电子元件技术领域，包括陶瓷层和导电层，所述陶瓷层和导电层相邻设置，所述陶瓷层的原料包括陶瓷浆料，所述陶瓷浆料包括以下组分：改性粉体A、三羟甲基丙烷三丙烯酸酯A、1，6‑己二醇二丙烯酸酯A、光引发剂A和聚丙烯酸钠A。本发明中，癸二酸能够对氧化铝粉体表面电位进行修饰，其中一部分羧基会与氧化铝粉体表面原子或离子形成配位键或离子键，因而能够降低氧化铝粉体表面能，以改性粉体为原料后续制作的陶瓷浆料内摩擦小，降低了陶瓷浆料的黏度，另一部分羧基则通过形成氢键的方式桥接在氧化铝粉体表面，改变了氧化铝粉体表面的电位，氧化铝粉体之间由于同种电荷相互排斥而减少了接触碰撞。
Ceramic packaging base and manufacturing method thereof
一种陶瓷封装基座及其制作方法
GAN JIANMING (Autor:in)
22.11.2024
Patent
Elektronische Ressource
Chinesisch
IPC:
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
/
B33Y
ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
,
Additive (generative) Fertigung, d. h. die Herstellung von dreidimensionalen [3D] Bauteilen durch additive Abscheidung, additive Agglomeration oder additive Schichtung, z. B. durch 3D- Drucken, Stereolithografie oder selektives Lasersintern
/
C04B
Kalk
,
LIME
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