Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
High-thermal-conductivity aluminum oxide ceramic substrate and preparation method thereof
The invention relates to the technical field of ceramic substrates, in particular to a high-heat-conductivity aluminum oxide ceramic substrate and a preparation method thereof.The high-heat-conductivity aluminum oxide ceramic substrate comprises aluminum oxide, beryllium oxide and silicon carbide which are all powdery, and the substrate further comprises a heat conduction preparation, a dispersing agent and a solvent, the weight parts of the aluminum oxide, the beryllium oxide, the silicon carbide, the heat conduction preparation, the dispersing agent and the solvent are respectively 59%-85%, 10%-16%, 8%-13%, 9%-15%, 7%-14% and 3%-8%, the heat conduction preparation is a mixture of diamond powder and graphene, and the proportions of the diamond powder and the graphene in the heat conduction preparation are 80%-90% and 18%-21%; the heat conduction performance of the ceramic substrate can be remarkably improved, the heat conduction efficiency of the ceramic substrate is enhanced, and meanwhile the ceramic substrate has good mechanical performance and machinability and adapts to various complex working environments.
本发明涉及陶瓷基板技术领域，特别是涉及一种高导热氧化铝陶瓷基板及其制备方法，组分包括氧化铝、氧化铍和碳化硅，氧化铝、氧化铍和碳化硅均为粉末状，基板组分还包括导热制剂、分散剂和溶剂，氧化铝、氧化铍、碳化硅、导热制剂、分散剂和溶剂按重量计份分别为59%‑85%、10%‑16%、8%‑13%、9%‑15%、7%‑14%、3%‑8%，导热制剂为金刚石粉末和石墨烯的混合物，金刚石粉末和石墨烯在导热制剂中的占比为80%‑90%和18%‑21%；本发明能够显著提升陶瓷基板的导热性能，增强了陶瓷基板的热传导效率，同时能够使得陶瓷基板具有良好的机械性能和加工性，适应多种复杂工作环境。
High-thermal-conductivity aluminum oxide ceramic substrate and preparation method thereof
The invention relates to the technical field of ceramic substrates, in particular to a high-heat-conductivity aluminum oxide ceramic substrate and a preparation method thereof.The high-heat-conductivity aluminum oxide ceramic substrate comprises aluminum oxide, beryllium oxide and silicon carbide which are all powdery, and the substrate further comprises a heat conduction preparation, a dispersing agent and a solvent, the weight parts of the aluminum oxide, the beryllium oxide, the silicon carbide, the heat conduction preparation, the dispersing agent and the solvent are respectively 59%-85%, 10%-16%, 8%-13%, 9%-15%, 7%-14% and 3%-8%, the heat conduction preparation is a mixture of diamond powder and graphene, and the proportions of the diamond powder and the graphene in the heat conduction preparation are 80%-90% and 18%-21%; the heat conduction performance of the ceramic substrate can be remarkably improved, the heat conduction efficiency of the ceramic substrate is enhanced, and meanwhile the ceramic substrate has good mechanical performance and machinability and adapts to various complex working environments.
本发明涉及陶瓷基板技术领域，特别是涉及一种高导热氧化铝陶瓷基板及其制备方法，组分包括氧化铝、氧化铍和碳化硅，氧化铝、氧化铍和碳化硅均为粉末状，基板组分还包括导热制剂、分散剂和溶剂，氧化铝、氧化铍、碳化硅、导热制剂、分散剂和溶剂按重量计份分别为59%‑85%、10%‑16%、8%‑13%、9%‑15%、7%‑14%、3%‑8%，导热制剂为金刚石粉末和石墨烯的混合物，金刚石粉末和石墨烯在导热制剂中的占比为80%‑90%和18%‑21%；本发明能够显著提升陶瓷基板的导热性能，增强了陶瓷基板的热传导效率，同时能够使得陶瓷基板具有良好的机械性能和加工性，适应多种复杂工作环境。
High-thermal-conductivity aluminum oxide ceramic substrate and preparation method thereof
一种高导热氧化铝陶瓷基板及其制备方法
SHI JUNNAN (Autor:in) / JIANG YONGPING (Autor:in) / ZHOU JIANCAO (Autor:in) / MENG BIQING (Autor:in)
10.12.2024
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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