Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
SINTERED DIAMOND HAVING HIGH THERMAL CONDUCTIVITY
A diamond heat sink for mounting a semiconductor chip, in which a surface finished sintered compact is used as a substrate and at least one pair of two opposite faces are coated with a metal film, the sintered compact being a high thermal conductivity diamond sintered compact comprising 60 vol.% to 90 vol.% of diamond grains on the whole sintered compact basis and the balance of substantially copper, which is substantially free from pores inside and has a diamond grain size distribution peak in a range of from 5 µm to 100 µm, at least two of the diamond grains constructing the sintered compact being directly bonded with each other, the copper forming the sintered compact substantially not being oxidized and the quantity of oxygen in the sintered compact being at most 0.025 weight %.
SINTERED DIAMOND HAVING HIGH THERMAL CONDUCTIVITY
A diamond heat sink for mounting a semiconductor chip, in which a surface finished sintered compact is used as a substrate and at least one pair of two opposite faces are coated with a metal film, the sintered compact being a high thermal conductivity diamond sintered compact comprising 60 vol.% to 90 vol.% of diamond grains on the whole sintered compact basis and the balance of substantially copper, which is substantially free from pores inside and has a diamond grain size distribution peak in a range of from 5 µm to 100 µm, at least two of the diamond grains constructing the sintered compact being directly bonded with each other, the copper forming the sintered compact substantially not being oxidized and the quantity of oxygen in the sintered compact being at most 0.025 weight %.
SINTERED DIAMOND HAVING HIGH THERMAL CONDUCTIVITY
GESINTERTER DIAMANT MIT HOHER WÄRMELEITFÄHIGKEIT
DIAMANT FRITTE PRESENTANT UNE CONDUCTIVITE THERMIQUE ELEVEE
YOSHIDA KATSUHITO (Autor:in) / MORIGAMI HIDEAKI (Autor:in) / AWAJI TAKAHIRO (Autor:in) / NAKAI TETSUO (Autor:in)
27.12.2017
Patent
Elektronische Ressource
Englisch
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