Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
DIAMOND SINTERED COMPACT
An object is to raise both the wear resistance and chipping resistance of diamond sintered compacts while taking advantage of the characteristics of highly chipping-resistant microfine-grain diamond sintered compacts. A sintered diamond layer 3 is formed by sintering diamond grains and a binder on a cemented carbide substrate 2. This sintered diamond layer 3 comprises a main diamond layer 4 and a Co-rich diamond layer 5 that is present between the main diamond layer 4 and the cemented carbide substrate 2 and that has a Co content larger than that of the main diamond layer 4; the main diamond layer has a residual compressive stress of 1.5 GPa to 3 GPa.
DIAMOND SINTERED COMPACT
An object is to raise both the wear resistance and chipping resistance of diamond sintered compacts while taking advantage of the characteristics of highly chipping-resistant microfine-grain diamond sintered compacts. A sintered diamond layer 3 is formed by sintering diamond grains and a binder on a cemented carbide substrate 2. This sintered diamond layer 3 comprises a main diamond layer 4 and a Co-rich diamond layer 5 that is present between the main diamond layer 4 and the cemented carbide substrate 2 and that has a Co content larger than that of the main diamond layer 4; the main diamond layer has a residual compressive stress of 1.5 GPa to 3 GPa.
DIAMOND SINTERED COMPACT
DIAMANT-SINTERKÖRPER
FRITTE DE DIAMANT
KURODA YOSHIHIRO (Autor:in) / KUKINO SATORU (Autor:in) / FUKAYA TOMOHIRO (Autor:in)
17.08.2016
Patent
Elektronische Ressource
Englisch
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