Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
VERFAHREN ZUM FÜGEN VON SUBSTRATEN
The invention relates to a method of joining substrates. It is the object of the invention in this respect to join substrates of substrate materials together without having to exert an increased effort for a coating with additional coating processes to be carried out and to be able to achieve a good quality of the join connection in so doing. In the method in accordance with the invention a pretreatment of at least one join surface of a substrate to be joined is carried out in low pressure oxygen plasma prior to the actual joining. On the joining, a contact force acts on the substrates to be joined in the range 2 kPa to 5 MPa and in this process a heat treatment is carried out at an elevated temperature of at least 100° C. and at under pressure conditions of a maximum of 10 mbar, preferably <10−3 mbar.
VERFAHREN ZUM FÜGEN VON SUBSTRATEN
The invention relates to a method of joining substrates. It is the object of the invention in this respect to join substrates of substrate materials together without having to exert an increased effort for a coating with additional coating processes to be carried out and to be able to achieve a good quality of the join connection in so doing. In the method in accordance with the invention a pretreatment of at least one join surface of a substrate to be joined is carried out in low pressure oxygen plasma prior to the actual joining. On the joining, a contact force acts on the substrates to be joined in the range 2 kPa to 5 MPa and in this process a heat treatment is carried out at an elevated temperature of at least 100° C. and at under pressure conditions of a maximum of 10 mbar, preferably <10−3 mbar.
VERFAHREN ZUM FÜGEN VON SUBSTRATEN
METHOD FOR JOINING SUBSTRATES
PROCÉDÉ POUR ASSEMBLER DES SUBSTRATS
KALKOWSKI GERHARD (Autor:in) / ROTHHARDT CAROLIN (Autor:in) / ROHDE MATHIAS (Autor:in) / EBERHARDT RAMONA (Autor:in)
07.11.2018
Patent
Elektronische Ressource
Deutsch
IPC:
C03C
Chemische Zusammensetzungen für Gläser, Glasuren oder Emails
,
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS
/
B23K
Löten
,
SOLDERING OR UNSOLDERING
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C03B
Herstellung oder Formgebung von Glas, Mineral- oder Schlackenwolle
,
MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL
/
C04B
Kalk
,
LIME
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
| TIBKAT | 1987
| Europäisches Patentamt | 2021
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Verfahren zur Herstellung von Substraten für Leistungshalbleiterbauelemente
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