Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
BONDED BODY, POWER MODULE SUBSTRATE WITH HEAT SINK, USE OF THE BONDED BODY AS A HEAT SINK, METHOD FOR MANUFACTURING BONDED BODY
The present invention is a bonded body in which an aluminum member constituted by an aluminum alloy, and a metal member constituted by copper, nickel, or silver are bonded to each other. The aluminum member is constituted by an aluminum alloy in which a solidus temperature is set to be less than a eutectic temperature of a metal element that constitutes the metal member and aluminum. A Ti layer is formed at a bonding portion between the aluminum member and the metal member, and the aluminum member and the Ti layer, and the Ti layer and the metal member are respectively subjected to solid-phase diffusion bonding.
BONDED BODY, POWER MODULE SUBSTRATE WITH HEAT SINK, USE OF THE BONDED BODY AS A HEAT SINK, METHOD FOR MANUFACTURING BONDED BODY
The present invention is a bonded body in which an aluminum member constituted by an aluminum alloy, and a metal member constituted by copper, nickel, or silver are bonded to each other. The aluminum member is constituted by an aluminum alloy in which a solidus temperature is set to be less than a eutectic temperature of a metal element that constitutes the metal member and aluminum. A Ti layer is formed at a bonding portion between the aluminum member and the metal member, and the aluminum member and the Ti layer, and the Ti layer and the metal member are respectively subjected to solid-phase diffusion bonding.
BONDED BODY, POWER MODULE SUBSTRATE WITH HEAT SINK, USE OF THE BONDED BODY AS A HEAT SINK, METHOD FOR MANUFACTURING BONDED BODY
GEBONDETER KÖRPER, LEISTUNGSMODULSUBSTRAT MIT KÜHLKÖRPER, VERWENDUNG DES GEBONDETEN KÖRPERS ALS KÜHLKÖRPER, VERFAHREN ZUR HERSTELLUNG DES GEBONDETEN KÖRPERS
CORPS SOUDÉ, SUBSTRAT DE MODULE DE PUISSANCE AVEC DISSIPATEUR THERMIQUE, UTILISATION DU CORPS SOUDÉ COMME DISSIPATEUR THERMIQUE, PROCÉDÉ DE FABRICATION DU CORPS SOUDÉ
TERASAKI NOBUYUKI (Autor:in) / NAGATOMO YOSHIYUKI (Autor:in)
05.05.2021
Patent
Elektronische Ressource
Englisch
BONDED BODY, INSULATED CIRCUIT BOARD WITH HEAT SINK, AND HEAT SINK
| Europäisches Patentamt | 2023
| Europäisches Patentamt | 2021