Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
BONDED BODY, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, HEAT SINK, METHOD FOR PRODUCING BONDED BODY, METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE WITH HEAT SINK, AND METHOD FOR PRODUCING HEAT SINK
A bonded body is provided in which an aluminum alloy member formed from an aluminum alloy, and a metal member formed from copper, nickel, or silver are bonded to each other. The aluminum alloy member is constituted by an aluminum alloy in which a concentration of Si is set in a range of 1 mass% to 25 mass%. The aluminum alloy member and the metal member are subjected to solid-phase diffusion bonding. A compound layer, which is formed through diffusion of Al of the aluminum alloy member and a metal element of the metal member, is provided at a bonding interface between the aluminum alloy member and the metal member. A Mg-concentrated layer, in which a concentration of Mg is set to 3 mass% or greater, is formed at the inside of the compound layer, and the thickness of the Mg-concentrated layer is set in a range of 1 µm to 30 µm.
BONDED BODY, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, HEAT SINK, METHOD FOR PRODUCING BONDED BODY, METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE WITH HEAT SINK, AND METHOD FOR PRODUCING HEAT SINK
A bonded body is provided in which an aluminum alloy member formed from an aluminum alloy, and a metal member formed from copper, nickel, or silver are bonded to each other. The aluminum alloy member is constituted by an aluminum alloy in which a concentration of Si is set in a range of 1 mass% to 25 mass%. The aluminum alloy member and the metal member are subjected to solid-phase diffusion bonding. A compound layer, which is formed through diffusion of Al of the aluminum alloy member and a metal element of the metal member, is provided at a bonding interface between the aluminum alloy member and the metal member. A Mg-concentrated layer, in which a concentration of Mg is set to 3 mass% or greater, is formed at the inside of the compound layer, and the thickness of the Mg-concentrated layer is set in a range of 1 µm to 30 µm.
BONDED BODY, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, HEAT SINK, METHOD FOR PRODUCING BONDED BODY, METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE WITH HEAT SINK, AND METHOD FOR PRODUCING HEAT SINK
VERBUNDENER KÖRPER, SUBSTRAT FÜR EIN LEISTUNGSMODUL MIT EINEM KÜHLKÖRPER, KÜHLKÖRPER, VERFAHREN ZUR HERSTELLUNG DES VERBUNDENEN KÖRPERS, VERFAHREN ZUR HERSTELLUNG DES SUBSTRATS FÜR EIN LEISTUNGSMODUL MIT EINEM KÜHLKÖRPER UND VERFAHREN ZUR HERSTELLUNG EINES KÜHLKÖRPERS
CORPS LIÉ, SUBSTRAT POUR MODULE D'ALIMENTATION POURVU D'UN DISSIPATEUR THERMIQUE, DISSIPATEUR THERMIQUE, PROCÉDÉ DE FABRICATION DE CORPS LIÉ, PROCÉDÉ DE FABRICATION DE SUBSTRAT POUR MODULE D'ALIMENTATION POURVU D'UN DISSIPATEUR THERMIQUE, ET PROCÉDÉ DE FABRICATION DE DISSIPATEUR THERMIQUE
TERASAKI NOBUYUKI (Autor:in) / NAGATOMO YOSHIYUKI (Autor:in)
28.07.2021
Patent
Elektronische Ressource
Englisch
| Europäisches Patentamt | 2016
| Europäisches Patentamt | 2021
| Europäisches Patentamt | 2021