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HEAT TRANSPORT STRUCTURE AND MANUFACTURING METHOD THEREFOR
In order to provide a thermal transport structure excellent in bendability, heat dissipation property, and lightweight property and also a thermal transport structure having a high reliability against vibrations and an excellent heat transport performance, used is a thermal transport structure (5, 201) including stacked graphite sheets (1, 213). This thermal transport structure (5, 201) includes a fixing portion (10, 202, 301) in which the stacked graphite sheets (1, 213) are fixed to each other; and a thermally conductive portion (11, 203) in which the stacked graphite sheets (1, 213) are not fixed to each other.
HEAT TRANSPORT STRUCTURE AND MANUFACTURING METHOD THEREFOR
In order to provide a thermal transport structure excellent in bendability, heat dissipation property, and lightweight property and also a thermal transport structure having a high reliability against vibrations and an excellent heat transport performance, used is a thermal transport structure (5, 201) including stacked graphite sheets (1, 213). This thermal transport structure (5, 201) includes a fixing portion (10, 202, 301) in which the stacked graphite sheets (1, 213) are fixed to each other; and a thermally conductive portion (11, 203) in which the stacked graphite sheets (1, 213) are not fixed to each other.
HEAT TRANSPORT STRUCTURE AND MANUFACTURING METHOD THEREFOR
WÄRMETRANSPORTSTRUKTUR UND HERSTELLUNGSVERFAHREN DAFÜR
STRUCTURE DE TRANSPORT DE CHALEUR ET SON PROCÉDÉ DE FABRICATION
KUTSUMIZU MAKOTO (Autor:in) / OKU SATOSHI (Autor:in) / KATO YUSUKE (Autor:in) / NISHIKAWA YASUSHI (Autor:in)
23.02.2022
Patent
Elektronische Ressource
Englisch
IPC:
C04B
Kalk
,
LIME
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C01B
NON-METALLIC ELEMENTS
,
Nichtmetallische Elemente
/
F28F
Einzelheiten von Wärmetauschern oder Wärmeübertragungsvorrichtungen für allgemeine Verwendung
,
DETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
HEAT TRANSPORT STRUCTURE AND MANUFACTURING METHOD THEREFOR
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|Heat transport structure and manufacturing method thereof
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