Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Heat transport structure and manufacturing method thereof
In order to provide a thermal transport structure excellent in bendability, heat dissipation property, and lightweight property and also a thermal transport structure having a high reliability against vibrations and an excellent heat transport performance, used is a thermal transport structure (5, 201) including stacked graphite sheets (1, 213). This thermal transport structure (5, 201) includes a fixing portion (10, 202, 301) in which the stacked graphite sheets (1, 213) are fixed to each other; and a thermally conductive portion (11, 203) in which the stacked graphite sheets (1, 213) are not fixed to each other.
Heat transport structure and manufacturing method thereof
In order to provide a thermal transport structure excellent in bendability, heat dissipation property, and lightweight property and also a thermal transport structure having a high reliability against vibrations and an excellent heat transport performance, used is a thermal transport structure (5, 201) including stacked graphite sheets (1, 213). This thermal transport structure (5, 201) includes a fixing portion (10, 202, 301) in which the stacked graphite sheets (1, 213) are fixed to each other; and a thermally conductive portion (11, 203) in which the stacked graphite sheets (1, 213) are not fixed to each other.
Heat transport structure and manufacturing method thereof
KUTSUMIZU MAKOTO (Autor:in) / OKU SATOSHI (Autor:in) / KATO YUSUKE (Autor:in) / NISHIKAWA YASUSHI (Autor:in)
14.07.2020
Patent
Elektronische Ressource
Englisch
IPC:
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C01B
NON-METALLIC ELEMENTS
,
Nichtmetallische Elemente
/
C04B
Kalk
,
LIME
/
F28F
Einzelheiten von Wärmetauschern oder Wärmeübertragungsvorrichtungen für allgemeine Verwendung
,
DETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
/
H05K
PRINTED CIRCUITS
,
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