Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
HIGH TEMPERATURE INKS FOR ELECTRONIC AND AEROSPACE APPLICATIONS
A printable material in ink form for forming electronic and structural components capable of high temperature performance includes a polymeric or oligomeric ceramic precursor, a filler material and an optional liquid carrier. The ceramic precursor materials may be silicon carbide, silicon oxycarbide, silicon nitride, silicon carbonitride, silicon oxycarbonitride, gallium containing group 13 oligomeric compounds and mixtures thereof. The ceramic precursor may be deposited by a direct ink writing (DIW) process.
HIGH TEMPERATURE INKS FOR ELECTRONIC AND AEROSPACE APPLICATIONS
A printable material in ink form for forming electronic and structural components capable of high temperature performance includes a polymeric or oligomeric ceramic precursor, a filler material and an optional liquid carrier. The ceramic precursor materials may be silicon carbide, silicon oxycarbide, silicon nitride, silicon carbonitride, silicon oxycarbonitride, gallium containing group 13 oligomeric compounds and mixtures thereof. The ceramic precursor may be deposited by a direct ink writing (DIW) process.
HIGH TEMPERATURE INKS FOR ELECTRONIC AND AEROSPACE APPLICATIONS
HOCHTEMPERATURTINTEN FÜR ELEKTRONIK- UND LUFT- UND RAUMFAHRTANWENDUNGEN
ENCRES À HAUTE TEMPÉRATURE POUR DES APPLICATIONS ÉLECTRONIQUES ET AÉROSPATIALES
SCHMIDT WAYDE R (Autor:in) / SHEEDY PAUL (Autor:in)
30.05.2018
Patent
Elektronische Ressource
Englisch
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