Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
HIGH TEMPERATURE INKS FOR ELECTRONIC AND AEROSPACE APPLICATIONS
A printable material in ink form for forming electronic and structural components capable of high temperature performance may include a polymeric or oligomeric ceramic precursor. The material may also include a filler material and an optional liquid carrier. The ceramic precursor materials may be silicon carbide, silicon oxycarbide, silicon nitride, silicon carbonitride, silicon oxycarbonitride, gallium containing group 13 oligomeric compounds and mixtures thereof. The ceramic precursor may be deposited by a direct ink writing (DIW) process.
HIGH TEMPERATURE INKS FOR ELECTRONIC AND AEROSPACE APPLICATIONS
A printable material in ink form for forming electronic and structural components capable of high temperature performance may include a polymeric or oligomeric ceramic precursor. The material may also include a filler material and an optional liquid carrier. The ceramic precursor materials may be silicon carbide, silicon oxycarbide, silicon nitride, silicon carbonitride, silicon oxycarbonitride, gallium containing group 13 oligomeric compounds and mixtures thereof. The ceramic precursor may be deposited by a direct ink writing (DIW) process.
HIGH TEMPERATURE INKS FOR ELECTRONIC AND AEROSPACE APPLICATIONS
SCHMIDT WAYDE R (Autor:in) / SHEEDY PAUL (Autor:in)
31.05.2018
Patent
Elektronische Ressource
Englisch
IPC:
C09D
Überzugsmittel, z.B. Anstrichstoffe, Firnisse oder Lacke
,
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS
/
B41J
TYPEWRITERS
,
Schreibmaschinen
/
C04B
Kalk
,
LIME
/
C23C
Beschichten metallischer Werkstoffe
,
COATING METALLIC MATERIAL
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
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