Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
CERAMIC MATERIAL ASSEMBLY FOR USE IN HIGHLY CORROSIVE OR EROSIVE SEMICONDUCTOR PROCESSING APPLICATIONS
A composite assembly of a relatively inexpensive ceramic, such as alumina, with a skin, or covering, of a high wear ceramic, such as sapphire, adapted to be used in semiconductor processing environments subjected to high levels of corrosion and/or erosion. The design life of the composite assembly may be significantly longer than previously used components. The composite assembly may have its ceramic pieces joined together with aluminum, such that the joint is not vulnerable to corrosive aspects to which the composite assembly may be exposed.
CERAMIC MATERIAL ASSEMBLY FOR USE IN HIGHLY CORROSIVE OR EROSIVE SEMICONDUCTOR PROCESSING APPLICATIONS
A composite assembly of a relatively inexpensive ceramic, such as alumina, with a skin, or covering, of a high wear ceramic, such as sapphire, adapted to be used in semiconductor processing environments subjected to high levels of corrosion and/or erosion. The design life of the composite assembly may be significantly longer than previously used components. The composite assembly may have its ceramic pieces joined together with aluminum, such that the joint is not vulnerable to corrosive aspects to which the composite assembly may be exposed.
CERAMIC MATERIAL ASSEMBLY FOR USE IN HIGHLY CORROSIVE OR EROSIVE SEMICONDUCTOR PROCESSING APPLICATIONS
KERAMISCHE MATERIALANORDNUNG ZUR VERWENDUNG IN HOCHKORROSIVEN ODER EROSIVEN HALBLEITERVERARBEITUNGSANWENDUNGEN
ENSEMBLE EN MATÉRIAUX CÉRAMIQUES DESTINÉ À ÊTRE UTILISÉ DANS DES APPLICATIONS DE TRAITEMENT DE SEMI-CONDUCTEURS HAUTEMENT CORROSIF OU ÉROSIF
ELLIOT BRENT (Autor:in) / REX DENNIS (Autor:in)
30.12.2020
Patent
Elektronische Ressource
Englisch
IPC:
H01J
Elektrische Entladungsröhren oder Entladungslampen
,
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
/
B23K
Löten
,
SOLDERING OR UNSOLDERING
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C04B
Kalk
,
LIME
/
C23C
Beschichten metallischer Werkstoffe
,
COATING METALLIC MATERIAL
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
CERAMIC MATERIAL ASSEMBLY FOR USE IN HIGHLY CORROSIVE OR EROSIVE INDUSTRIAL APPLICATIONS
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