Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
LOGIC POWER MODULE WITH A THICK-FILM PASTE MEDIATED SUBSTRATE BONDED WITH METAL OR METAL HYBRID FOILS
A logic power module, comprising at least one logic component, at least one power component and a substrate, whereby the logic element and the power component are provided in separate areas on the substrate is described. The logic component on the substrate is provided by thick printed copper; and the power component is provided by a metal-containing thick-film layer, and, provided thereon, a metal foil.
LOGIC POWER MODULE WITH A THICK-FILM PASTE MEDIATED SUBSTRATE BONDED WITH METAL OR METAL HYBRID FOILS
A logic power module, comprising at least one logic component, at least one power component and a substrate, whereby the logic element and the power component are provided in separate areas on the substrate is described. The logic component on the substrate is provided by thick printed copper; and the power component is provided by a metal-containing thick-film layer, and, provided thereon, a metal foil.
LOGIC POWER MODULE WITH A THICK-FILM PASTE MEDIATED SUBSTRATE BONDED WITH METAL OR METAL HYBRID FOILS
LOGIKLEISTUNGSMODUL MIT EINEM DURCH DICKSCHICHTPASTE VERMITTELTEN SUBSTRAT, DAS MIT METALL- ODER METALLHYBRIDFOLIEN VERBUNDEN IST
MODULE DE PUISSANCE LOGIQUE AVEC UN SUBSTRAT À MÉDIATION PAR PÂTE DE FILM ÉPAIS LIÉ À DES FEUILLES MÉTALLIQUES OU HYBRIDES MÉTALLIQUES
MIRIC ANTON (Autor:in) / HERBST KAI (Autor:in) / RAUER MIRIAM (Autor:in) / JUNG CHRISTIAN (Autor:in) / DIETRICH PETER (Autor:in)
04.03.2020
Patent
Elektronische Ressource
Englisch
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