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    LOGIC POWER MODULE WITH A THICK-FILM PASTE MEDIATED SUBSTRATE BONDED WITH METAL OR METAL HYBRID FOILS

    Neue Suche nach: MIRIC ANTON
    Neue Suche nach: HERBST KAI
    Neue Suche nach: RAUER MIRIAM
    Neue Suche nach: JUNG CHRISTIAN
    Neue Suche nach: DIETRICH PETER

    One aspect is a logic power module, with at least one logic component, at least one power component and a substrate. The logic element and the power component are provided in separate areas on the substrate. The logic component on the substrate is provided by thick printed copper; and the power component is provided by a metal-containing thick-film layer, and, provided thereon, a metal foil.

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    LOGIC POWER MODULE WITH A THICK-FILM PASTE MEDIATED SUBSTRATE BONDED WITH METAL OR METAL HYBRID FOILS

    Neue Suche nach: MIRIC ANTON
    Neue Suche nach: HERBST KAI
    Neue Suche nach: RAUER MIRIAM
    Neue Suche nach: JUNG CHRISTIAN
    Neue Suche nach: DIETRICH PETER

    One aspect is a logic power module, with at least one logic component, at least one power component and a substrate. The logic element and the power component are provided in separate areas on the substrate. The logic component on the substrate is provided by thick printed copper; and the power component is provided by a metal-containing thick-film layer, and, provided thereon, a metal foil.

    Zugriff

    Download

    LOGIC POWER MODULE WITH A THICK-FILM PASTE MEDIATED SUBSTRATE BONDED WITH METAL OR METAL HYBRID FOILS

    Neue Suche nach: MIRIC ANTON
    Neue Suche nach: HERBST KAI
    Neue Suche nach: RAUER MIRIAM
    Neue Suche nach: JUNG CHRISTIAN
    Neue Suche nach: DIETRICH PETER

    One aspect is a logic power module, with at least one logic component, at least one power component and a substrate. The logic element and the power component are provided in separate areas on the substrate. The logic component on the substrate is provided by thick printed copper; and the power component is provided by a metal-containing thick-film layer, and, provided thereon, a metal foil.

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    Ähnliche Titel

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    Titel:

    LOGIC POWER MODULE WITH A THICK-FILM PASTE MEDIATED SUBSTRATE BONDED WITH METAL OR METAL HYBRID FOILS

    Beteiligte:

    MIRIC ANTON (Autor:in) / HERBST KAI (Autor:in) / RAUER MIRIAM (Autor:in) / JUNG CHRISTIAN (Autor:in) / DIETRICH PETER (Autor:in)

    Erscheinungsdatum:

    25.06.2020

    Medientyp:

    Patent

    Format:

    Elektronische Ressource

    Sprache:

    Englisch

    Klassifikation:

    IPC:  C04B Kalk , LIME / C03C Chemische Zusammensetzungen für Gläser, Glasuren oder Emails , CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES

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    LOGIC POWER MODULE WITH A THICK-FILM PASTE MEDIATED SUBSTRATE BONDED WITH METAL OR METAL HYBRID FOILS

    MIRIC ANTON / HERBST KAI / RAUER MIRIAM et al. | Europäisches Patentamt | 2020

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    LOGIC POWER MODULE WITH A THICK-FILM PASTE MEDIATED SUBSTRATE BONDED WITH METAL OR METAL HYBRID FOILS

    MIRIC ANTON / RAUER MIRIAM / HERBST KAI et al. | Europäisches Patentamt | 2018

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    LOGIC POWER MODULE WITH A THICK-FILM PASTE MEDIATED SUBSTRATE BONDED WITH METAL OR METAL HYBRID FOILS

    MIRIC ANTON / HERBST KAI / RAUER MIRIAM et al. | Europäisches Patentamt | 2018

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    THICK-FILM PASTE MEDIATED CERAMICS BONDED WITH METAL OR METAL HYBRID FOILS

    GUNDEL PAUL / MIRIC ANTON / BAWOHL MELANIE et al. | Europäisches Patentamt | 2023

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    THICK-FILM PASTE MEDIATED CERAMICS BONDED WITH METAL OR METAL HYBRID FOILS

    GUNDEL PAUL / MIRIC ANTON / BAWOHL MELANIE et al. | Europäisches Patentamt | 2019

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