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    CERAMIC CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR

    Neue Suche nach: YUASA AKIMASA
    Neue Suche nach: HARADA YUSAKU
    Neue Suche nach: NAKAMURA TAKAHIRO
    Neue Suche nach: MORITA SHUHEI
    Neue Suche nach: NISHIMURA KOUJI

    [Problem] To provide a ceramic circuit substrate having high bonding performance and excellent thermal cycling resistance properties.[Solution] A ceramic circuit substrate having a circuit pattern provided on a ceramic substrate with a braze material layer interposed therebetween, and a protruding portion formed by the braze material layer protruding from the outer edge of the circuit pattern, wherein: the braze material layer comprises Ag, Cu, Ti, and Sn or In; and an Ag-rich phase is formed continuously for 300 µm or more, towards the inside, from an outer edge of the protruding portion, along a bonding interface between the ceramic substrate and the circuit pattern, and has a bonding void ratio of 1.0% or less.

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    CERAMIC CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR

    Neue Suche nach: YUASA AKIMASA
    Neue Suche nach: HARADA YUSAKU
    Neue Suche nach: NAKAMURA TAKAHIRO
    Neue Suche nach: MORITA SHUHEI
    Neue Suche nach: NISHIMURA KOUJI

    [Problem] To provide a ceramic circuit substrate having high bonding performance and excellent thermal cycling resistance properties.[Solution] A ceramic circuit substrate having a circuit pattern provided on a ceramic substrate with a braze material layer interposed therebetween, and a protruding portion formed by the braze material layer protruding from the outer edge of the circuit pattern, wherein: the braze material layer comprises Ag, Cu, Ti, and Sn or In; and an Ag-rich phase is formed continuously for 300 µm or more, towards the inside, from an outer edge of the protruding portion, along a bonding interface between the ceramic substrate and the circuit pattern, and has a bonding void ratio of 1.0% or less.

    Zugriff

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    CERAMIC CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR

    Neue Suche nach: YUASA AKIMASA
    Neue Suche nach: HARADA YUSAKU
    Neue Suche nach: NAKAMURA TAKAHIRO
    Neue Suche nach: MORITA SHUHEI
    Neue Suche nach: NISHIMURA KOUJI

    [Problem] To provide a ceramic circuit substrate having high bonding performance and excellent thermal cycling resistance properties.[Solution] A ceramic circuit substrate having a circuit pattern provided on a ceramic substrate with a braze material layer interposed therebetween, and a protruding portion formed by the braze material layer protruding from the outer edge of the circuit pattern, wherein: the braze material layer comprises Ag, Cu, Ti, and Sn or In; and an Ag-rich phase is formed continuously for 300 µm or more, towards the inside, from an outer edge of the protruding portion, along a bonding interface between the ceramic substrate and the circuit pattern, and has a bonding void ratio of 1.0% or less.

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    Titel:

    CERAMIC CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR

    Weitere Titelangaben:

    KERAMISCHE LEITERPLATTE UND HERSTELLUNGSVERFAHREN DAFÜR
    CARTE DE CIRCUIT IMPRIMÉ EN CÉRAMIQUE ET SON PROCÉDÉ DE PRODUCTION

    Beteiligte:

    YUASA AKIMASA (Autor:in) / HARADA YUSAKU (Autor:in) / NAKAMURA TAKAHIRO (Autor:in) / MORITA SHUHEI (Autor:in) / NISHIMURA KOUJI (Autor:in)

    Erscheinungsdatum:

    01.09.2021

    Medientyp:

    Patent

    Format:

    Elektronische Ressource

    Sprache:

    Englisch

    Klassifikation:

    IPC:  H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B23K Löten , SOLDERING OR UNSOLDERING / C04B Kalk , LIME / C22C Legierungen , ALLOYS / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES

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