Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
CERAMIC CIRCUIT BOARD AND METHOD OF PRODUCTION
[Problem] To provide a ceramic circuit substrate having high bonding performance and excellent thermal cycling resistance properties.[Solution] A ceramic circuit substrate wherein a ceramic substrate and a copper plate are bonded by a braze material containing Ag and Cu, at least one active metal component selected from Ti and Zr, and at least one element selected from among In, Zn, Cd, and Sn, wherein a braze material layer, after bonding, has a continuity ratio of 80% or higher and a Vickers hardness of 60 to 85 Hv.
CERAMIC CIRCUIT BOARD AND METHOD OF PRODUCTION
[Problem] To provide a ceramic circuit substrate having high bonding performance and excellent thermal cycling resistance properties.[Solution] A ceramic circuit substrate wherein a ceramic substrate and a copper plate are bonded by a braze material containing Ag and Cu, at least one active metal component selected from Ti and Zr, and at least one element selected from among In, Zn, Cd, and Sn, wherein a braze material layer, after bonding, has a continuity ratio of 80% or higher and a Vickers hardness of 60 to 85 Hv.
CERAMIC CIRCUIT BOARD AND METHOD OF PRODUCTION
KERAMISCHE LEITERPLATTE UND SEIN HERSTELLUNGSVERFAHREN
CARTE DE CIRCUIT IMPRIMÉ EN CÉRAMIQUE ET SON PROCEDE DE FABRICATION
TSUGAWA YUTA (Autor:in) / NISHIMURA KOUJI (Autor:in) / HARADA YUSAKU (Autor:in) / AONO RYOTA (Autor:in) / IWAKIRI SHOJI (Autor:in)
09.02.2022
Patent
Elektronische Ressource
Englisch
| Europäisches Patentamt | 2020
| Europäisches Patentamt | 2022
| Europäisches Patentamt | 2019