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METALL-KERAMIK-SUBSTRAT UND VERFAHREN ZUM HERSTELLEN EINES METALL-KERAMIK-SUBSTRATS
A metal-ceramic substrate (1) comprisingan insulating layer (11) comprising a ceramic and having a first thickness (D1), anda metallization layer (12) bonded to the insulation layer (11) and having a second thickness (D2),wherein the first thickness (D1) is less than 250 μm and the second thickness (D2) is greater than 200 μm and wherein the first thickness (D1) and the second thickness (D2) are dimensioned such that a ratio ofan amount of the difference between a thermal expansion coefficient of the metallization layer (12) and a thermal expansion coefficient of the metal-ceramic substrate (1) toa thermal expansion coefficient of the metal-ceramic substrate (1)has a value less than 0.25, preferably less than 0.2 and more preferably less than 0.15 or even less than 0.1.
METALL-KERAMIK-SUBSTRAT UND VERFAHREN ZUM HERSTELLEN EINES METALL-KERAMIK-SUBSTRATS
A metal-ceramic substrate (1) comprisingan insulating layer (11) comprising a ceramic and having a first thickness (D1), anda metallization layer (12) bonded to the insulation layer (11) and having a second thickness (D2),wherein the first thickness (D1) is less than 250 μm and the second thickness (D2) is greater than 200 μm and wherein the first thickness (D1) and the second thickness (D2) are dimensioned such that a ratio ofan amount of the difference between a thermal expansion coefficient of the metallization layer (12) and a thermal expansion coefficient of the metal-ceramic substrate (1) toa thermal expansion coefficient of the metal-ceramic substrate (1)has a value less than 0.25, preferably less than 0.2 and more preferably less than 0.15 or even less than 0.1.
METALL-KERAMIK-SUBSTRAT UND VERFAHREN ZUM HERSTELLEN EINES METALL-KERAMIK-SUBSTRATS
METAL-CERAMIC SUBSTRATE AND ITS MANUFACTURING METHOD
SUBSTRAT MÉTAL-CÉRAMIQUE ET SA MÉTHODE DE FABRICATION
MEYER ANDREAS (Autor:in) / BRITTING STEFAN (Autor:in)
23.06.2021
Patent
Elektronische Ressource
Deutsch
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