Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
COPPER/CERAMIC BONDED BODY, INSULATING CIRCUIT BOARD, COPPER/CERAMIC BONDED BODY PRODUCTION METHOD, AND INSULATING CIRCUIT BOARD PRODUCTION METHOD
A bonded body of copper and ceramic includes: a copper member (12) made of copper or a copper alloy and a ceramic member (11) made of an aluminum oxide, the copper member (12) and the ceramic member (11) being bonded to each other; a magnesium oxide layer (31) which is formed on a ceramic member (11) side between the copper member (12) and the ceramic member (11); and a Mg solid solution layer (32) which is formed between the magnesium oxide layer (31) and the copper member (12) and contains Mg in a state of a solid solution in a Cu primary phase, in which one or more active metals selected from Ti, Zr, Nb, and Hf are present in the Mg solid solution layer (32).
COPPER/CERAMIC BONDED BODY, INSULATING CIRCUIT BOARD, COPPER/CERAMIC BONDED BODY PRODUCTION METHOD, AND INSULATING CIRCUIT BOARD PRODUCTION METHOD
A bonded body of copper and ceramic includes: a copper member (12) made of copper or a copper alloy and a ceramic member (11) made of an aluminum oxide, the copper member (12) and the ceramic member (11) being bonded to each other; a magnesium oxide layer (31) which is formed on a ceramic member (11) side between the copper member (12) and the ceramic member (11); and a Mg solid solution layer (32) which is formed between the magnesium oxide layer (31) and the copper member (12) and contains Mg in a state of a solid solution in a Cu primary phase, in which one or more active metals selected from Ti, Zr, Nb, and Hf are present in the Mg solid solution layer (32).
COPPER/CERAMIC BONDED BODY, INSULATING CIRCUIT BOARD, COPPER/CERAMIC BONDED BODY PRODUCTION METHOD, AND INSULATING CIRCUIT BOARD PRODUCTION METHOD
VERBUNDENER KÖRPER AUS KUPFER/KERAMIK, ISOLIERENDE LEITERPLATTE, VERFAHREN ZUR HERSTELLUNG EINES VERBUNDENEN KÖRPERS AUS KUPFER/KERAMIK UND VERFAHREN ZUR HERSTELLUNG EINER ISOLIERENDEN LEITERPLATTE
CORPS LIÉ CUIVRE/CÉRAMIQUE, CARTE DE CIRCUIT IMPRIMÉ ISOLANTE, PROCÉDÉ DE PRODUCTION DE CORPS LIÉ CUIVRE/CÉRAMIQUE, ET PROCÉDÉ DE PRODUCTION DE CARTE DE CIRCUIT IMPRIMÉ ISOLANTE
TERASAKI NOBUYUKI (Autor:in)
20.10.2021
Patent
Elektronische Ressource
Englisch
| Europäisches Patentamt | 2019
| Europäisches Patentamt | 2021
| Europäisches Patentamt | 2022
| Europäisches Patentamt | 2024
| Europäisches Patentamt | 2021