Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
ELECTROSTATIC CHUCK AND MANUFACTURING METHOD THEREFOR
Disclosed are: an electrostatic chuck having a high volume resistivity so as to reduce a leakage current, thereby improving the adsorption and desorption response characteristics of a semiconductor wafer; and a manufacturing method therefor. The electrostatic chuck is a sintered body in which an electrode is impregnated so as to fix a semiconductor wafer by electrostatic force, and comprises alumina, a sintering aid, and a rare earth composite oxide comprising two to five different rare earth metals, has adsorption and desorption response characteristics of a semiconductor wafer of two seconds or less, and has a volume resistivity at room temperature of 1.0E + 16 Ω·cm to 1.0E + 17 Ω·cm.
ELECTROSTATIC CHUCK AND MANUFACTURING METHOD THEREFOR
Disclosed are: an electrostatic chuck having a high volume resistivity so as to reduce a leakage current, thereby improving the adsorption and desorption response characteristics of a semiconductor wafer; and a manufacturing method therefor. The electrostatic chuck is a sintered body in which an electrode is impregnated so as to fix a semiconductor wafer by electrostatic force, and comprises alumina, a sintering aid, and a rare earth composite oxide comprising two to five different rare earth metals, has adsorption and desorption response characteristics of a semiconductor wafer of two seconds or less, and has a volume resistivity at room temperature of 1.0E + 16 Ω·cm to 1.0E + 17 Ω·cm.
ELECTROSTATIC CHUCK AND MANUFACTURING METHOD THEREFOR
ELEKTROSTATISCHES SPANNFUTTER UND HERSTELLUNGSVERFAHREN DAFÜR
MANDRIN ÉLECTROSTATIQUE ET SON PROCÉDÉ DE FABRICATION
KIM YUN HO (Autor:in) / KIM JOO HWAN (Autor:in) / LEE KI RYONG (Autor:in)
03.08.2022
Patent
Elektronische Ressource
Englisch
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