Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
ELECTRIC CIRCUIT BOARD AND POWER MODULE
An electric circuit board (10) includes an insulating substrate (1), a metal plate (2), and a brazing material (3) with which the insulating substrate and the metal plate are joined together. The metal plate has a side surface over which recessed portions (21a) are scattered. The side surface of the metal plate has lines (21b) in regions around the recessed portions. The metal plate is made of copper or a copper alloy. The brazing material has a side surface that is continuous with the side surface of the metal plate. The brazing material is a silver-copper brazing alloy. A ratio of copper on the side surface of the brazing material is higher than a copper component ratio of the silver-copper brazing alloy.
ELECTRIC CIRCUIT BOARD AND POWER MODULE
An electric circuit board (10) includes an insulating substrate (1), a metal plate (2), and a brazing material (3) with which the insulating substrate and the metal plate are joined together. The metal plate has a side surface over which recessed portions (21a) are scattered. The side surface of the metal plate has lines (21b) in regions around the recessed portions. The metal plate is made of copper or a copper alloy. The brazing material has a side surface that is continuous with the side surface of the metal plate. The brazing material is a silver-copper brazing alloy. A ratio of copper on the side surface of the brazing material is higher than a copper component ratio of the silver-copper brazing alloy.
ELECTRIC CIRCUIT BOARD AND POWER MODULE
ELEKTRISCHE LEITERPLATTE UND LEISTUNGSMODUL
CARTE DE CIRCUIT ÉLECTRIQUE ET MODULE D'ÉNERGIE
KONISHI YOSHITADA (Autor:in)
20.09.2023
Patent
Elektronische Ressource
Englisch
CIRCUIT BOARD MANUFACTURING METHOD, CIRCUIT BOARD, AND POWER MODULE
| Europäisches Patentamt | 2024
| Europäisches Patentamt | 2017