Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
BONDED SUBSTRATE AND METHOD FOR MANUFACTURING BONDED SUBSTRATE
An adhesion strength of a bonding layer to a silicon nitride ceramic substrate is improved, and a bonded substrate which has high cold durability and in which migration does not occur is obtained. The bonded substrate includes the silicon nitride ceramic substrate, a copper plate, the bonding layer, and penetrating regions. The copper plate and the bonding layer are patterned into a predetermined shape, and are disposed over a main surface of the silicon nitride ceramic substrate. The bonding layer bonds the copper plate to the main surface of the silicon nitride ceramic substrate. The penetrating regions each include one or more penetrating portions penetrating continuously from the main surface of the substrate into the silicon nitride ceramic substrate to a depth of 3 µm or more and 20 µm or less, and contain silver, and the number of penetrating regions present per square millimeter of the main surface of the substrate is one or more and 30 or less.
BONDED SUBSTRATE AND METHOD FOR MANUFACTURING BONDED SUBSTRATE
An adhesion strength of a bonding layer to a silicon nitride ceramic substrate is improved, and a bonded substrate which has high cold durability and in which migration does not occur is obtained. The bonded substrate includes the silicon nitride ceramic substrate, a copper plate, the bonding layer, and penetrating regions. The copper plate and the bonding layer are patterned into a predetermined shape, and are disposed over a main surface of the silicon nitride ceramic substrate. The bonding layer bonds the copper plate to the main surface of the silicon nitride ceramic substrate. The penetrating regions each include one or more penetrating portions penetrating continuously from the main surface of the substrate into the silicon nitride ceramic substrate to a depth of 3 µm or more and 20 µm or less, and contain silver, and the number of penetrating regions present per square millimeter of the main surface of the substrate is one or more and 30 or less.
BONDED SUBSTRATE AND METHOD FOR MANUFACTURING BONDED SUBSTRATE
GEBUNDENES SUBSTRAT UND VERFAHREN ZUR HERSTELLUNG EINES GEBUNDENEN SUBSTRATS
SUBSTRAT LIÉ ET PROCÉDÉ POUR LA FABRICATION D'UN SUBSTRAT LIÉ
EBIGASE TAKASHI (Autor:in) / MASUDA IZUMI (Autor:in) / KAKU TAKESHI (Autor:in)
03.01.2024
Patent
Elektronische Ressource
Englisch
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