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CERAMIC-CLADDED COPPER PLATE AND METHOD FOR MANUFACTURING CERAMIC-CLADDED COPPER PLATE
A method for preparing a ceramic copper clad laminate is provided, including following steps: providing a copper material; forming a copper oxide layer on a surface of the copper material; thermally treating the copper material on which the copper oxide layer is formed, to diffuse oxygen atoms in the copper material; removing the copper oxide layer on the thermally treated copper material; and soldering the copper-oxide-layer-removed copper material to a ceramic substrate to obtain a ceramic copper clad laminate.
CERAMIC-CLADDED COPPER PLATE AND METHOD FOR MANUFACTURING CERAMIC-CLADDED COPPER PLATE
A method for preparing a ceramic copper clad laminate is provided, including following steps: providing a copper material; forming a copper oxide layer on a surface of the copper material; thermally treating the copper material on which the copper oxide layer is formed, to diffuse oxygen atoms in the copper material; removing the copper oxide layer on the thermally treated copper material; and soldering the copper-oxide-layer-removed copper material to a ceramic substrate to obtain a ceramic copper clad laminate.
CERAMIC-CLADDED COPPER PLATE AND METHOD FOR MANUFACTURING CERAMIC-CLADDED COPPER PLATE
KERAMIKVERKLEIDETE KUPFERPLATTE UND VERFAHREN ZUR HERSTELLUNG EINER KERAMIKVERKLEIDETEN KUPFERPLATTE
PLAQUE DE CUIVRE PLAQUÉE DE CÉRAMIQUE ET PROCÉDÉ DE FABRICATION DE PLAQUE DE CUIVRE PLAQUÉE DE CÉRAMIQUE
ZHOU WEI (Autor:in) / XU QIANG (Autor:in) / XIE CAICAI (Autor:in)
27.12.2023
Patent
Elektronische Ressource
Englisch
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