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    CERAMIC-CLADDED COPPER PLATE AND METHOD FOR MANUFACTURING CERAMIC-CLADDED COPPER PLATE

    Neue Suche nach: ZHOU WEI
    Neue Suche nach: XU QIANG
    Neue Suche nach: XIE CAICAI

    A method for preparing a ceramic copper clad laminate is provided, including following steps: providing a copper material; forming a copper oxide layer on a surface of the copper material; thermally treating the copper material on which the copper oxide layer is formed, to diffuse oxygen atoms in the copper material; removing the copper oxide layer on the thermally treated copper material; and soldering the copper-oxide-layer-removed copper material to a ceramic substrate to obtain a ceramic copper clad laminate.

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    CERAMIC-CLADDED COPPER PLATE AND METHOD FOR MANUFACTURING CERAMIC-CLADDED COPPER PLATE

    Neue Suche nach: ZHOU WEI
    Neue Suche nach: XU QIANG
    Neue Suche nach: XIE CAICAI

    A method for preparing a ceramic copper clad laminate is provided, including following steps: providing a copper material; forming a copper oxide layer on a surface of the copper material; thermally treating the copper material on which the copper oxide layer is formed, to diffuse oxygen atoms in the copper material; removing the copper oxide layer on the thermally treated copper material; and soldering the copper-oxide-layer-removed copper material to a ceramic substrate to obtain a ceramic copper clad laminate.

    Zugriff

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    CERAMIC-CLADDED COPPER PLATE AND METHOD FOR MANUFACTURING CERAMIC-CLADDED COPPER PLATE

    Neue Suche nach: ZHOU WEI
    Neue Suche nach: XU QIANG
    Neue Suche nach: XIE CAICAI

    A method for preparing a ceramic copper clad laminate is provided, including following steps: providing a copper material; forming a copper oxide layer on a surface of the copper material; thermally treating the copper material on which the copper oxide layer is formed, to diffuse oxygen atoms in the copper material; removing the copper oxide layer on the thermally treated copper material; and soldering the copper-oxide-layer-removed copper material to a ceramic substrate to obtain a ceramic copper clad laminate.

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    Titel:

    CERAMIC-CLADDED COPPER PLATE AND METHOD FOR MANUFACTURING CERAMIC-CLADDED COPPER PLATE

    Beteiligte:

    ZHOU WEI (Autor:in) / XU QIANG (Autor:in) / XIE CAICAI (Autor:in)

    Erscheinungsdatum:

    24.08.2023

    Medientyp:

    Patent

    Format:

    Elektronische Ressource

    Sprache:

    Englisch

    Klassifikation:

    IPC:  H05K PRINTED CIRCUITS , Gedruckte Schaltungen / C04B Kalk , LIME

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