Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
THERMAL FILLER PARTICLE, THERMALLY CONDUCTIVE COMPOSITION, AND ASSEMBLY INCLUDING THE SAME
A shaped thermal filler particle has an elongate shape defined by a substantially planar first smooth surface and a second smooth surface that contacts the substantially planar first smooth surface along a planar closed path. The planar closed path has a length to width ratio of at least 1.5. The shaped thermal filler particle has a maximum linear dimension normal to the planar first smooth surface that is less than or equal to one half of the length of the closed path. A thermally conductive composition comprises from 1 to 95 percent by volume of the shaped thermal filler particles dispersed in a binder. An assembly comprises a heat source, a heat sink, and the thermally conductive composition at least partially sandwiched between the heat source and the heat sink.
THERMAL FILLER PARTICLE, THERMALLY CONDUCTIVE COMPOSITION, AND ASSEMBLY INCLUDING THE SAME
A shaped thermal filler particle has an elongate shape defined by a substantially planar first smooth surface and a second smooth surface that contacts the substantially planar first smooth surface along a planar closed path. The planar closed path has a length to width ratio of at least 1.5. The shaped thermal filler particle has a maximum linear dimension normal to the planar first smooth surface that is less than or equal to one half of the length of the closed path. A thermally conductive composition comprises from 1 to 95 percent by volume of the shaped thermal filler particles dispersed in a binder. An assembly comprises a heat source, a heat sink, and the thermally conductive composition at least partially sandwiched between the heat source and the heat sink.
THERMAL FILLER PARTICLE, THERMALLY CONDUCTIVE COMPOSITION, AND ASSEMBLY INCLUDING THE SAME
THERMISCHES FÜLLSTOFFPARTIKEL, WÄRMELEITENDE ZUSAMMENSETZUNG UND ANORDNUNG DAMIT
PARTICULE DE RENFORT THERMIQUE, COMPOSITION THERMOCONDUCTRICE ET ENSEMBLE LA CONTENANT
PODKAMINER JACOB P (Autor:in) / FREY MATTHEW H (Autor:in) / HO VICTOR (Autor:in) / JOHNSON MATTHEW T (Autor:in) / LARSEN JEREMY K (Autor:in) / LINDSAY CRAIG W (Autor:in) / PICHA KYLE C (Autor:in) / PEREZ MARIO A (Autor:in)
28.08.2024
Patent
Elektronische Ressource
Englisch
IPC:
C09K
Materialien für Anwendungen, soweit nicht anderweitig vorgesehen
,
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR
/
C04B
Kalk
,
LIME
/
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
THERMAL FILLER PARTICLE, THERMALLY CONDUCTIVE COMPOSITION, AND ASSEMBLY INCLUDING THE SAME
| Europäisches Patentamt | 2022
THERMALLY CONDUCTIVE FILLER AND THERMALLY CONDUCTIVE RESIN COMPOSITION CONTAINING SAME
| Europäisches Patentamt | 2016
Thermally conductive filler and thermally conductive resin composition containing same
| Europäisches Patentamt | 2017
THERMALLY CONDUCTIVE FILLER AND THERMALLY CONDUCTIVE RESIN COMPOSITION CONTAINING SAME
Europäisches Patentamt | 2019
| Europäisches Patentamt | 2021