Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
THERMALLY CONDUCTIVE FILLER, THERMALLY CONDUCTIVE COMPOSITE USING THE SAME, AND METHOD OF PRODUCING THERMALLY CONDUCTIVE FILLER
To provide a thermally conductive filler capable of imparting high heat conductivity to a matrix.SOLUTION: A thermally conductive filler is formed of pulverized material of a sintered body comprising: isotropic highly thermally conductive particles having an average particle size of 0.2-100 μm and a thermal conductivity of 20 W/mK or more; non-porous hexagonal boron nitride particles having an average particle size of 0.01-5 times the average particle size of the highly thermally conductive particles; and porous boron nitride. The porosity of the boron nitride phase formed by the hexagonal boron nitride particles and the porous boron nitride is 10-50 vol.%, and 40% or more, on a count basis, of all the highly thermally conductive particles in the pulverized material are in the form of composite particles with the hexagonal boron nitride particles which are bound via the porous boron nitride to at least a part of the surface of the highly thermally conductive particles.SELECTED DRAWING: None
【課題】マトリックスに高い熱伝導性を付与することが可能な熱伝導性フィラーを提供すること。【解決手段】平均粒子径が０．２〜１００μｍであり、熱伝導率が２０Ｗ／ｍＫ以上である等方性の高熱伝導性粒子と、該高熱伝導性粒子の平均粒子径の０．０１〜５倍の平均粒子径を有する非多孔性の六方晶窒化ホウ素粒子と、多孔性窒化ホウ素とを含有し、前記六方晶窒化ホウ素粒子及び前記多孔性窒化ホウ素により形成される窒化ホウ素相の空隙率が１０〜５０ｖｏｌ％である焼結体の粉砕物からなり、前記粉砕物中の全ての前記高熱伝導性粒子のうちの個数基準で４０％以上の粒子が、該高熱伝導性粒子の表面の少なくとも一部に前記多孔性窒化ホウ素を介して前記六方晶窒化ホウ素粒子が結合した複合粒子を形成していることを特徴とする熱伝導性フィラー。【選択図】なし
THERMALLY CONDUCTIVE FILLER, THERMALLY CONDUCTIVE COMPOSITE USING THE SAME, AND METHOD OF PRODUCING THERMALLY CONDUCTIVE FILLER
To provide a thermally conductive filler capable of imparting high heat conductivity to a matrix.SOLUTION: A thermally conductive filler is formed of pulverized material of a sintered body comprising: isotropic highly thermally conductive particles having an average particle size of 0.2-100 μm and a thermal conductivity of 20 W/mK or more; non-porous hexagonal boron nitride particles having an average particle size of 0.01-5 times the average particle size of the highly thermally conductive particles; and porous boron nitride. The porosity of the boron nitride phase formed by the hexagonal boron nitride particles and the porous boron nitride is 10-50 vol.%, and 40% or more, on a count basis, of all the highly thermally conductive particles in the pulverized material are in the form of composite particles with the hexagonal boron nitride particles which are bound via the porous boron nitride to at least a part of the surface of the highly thermally conductive particles.SELECTED DRAWING: None
【課題】マトリックスに高い熱伝導性を付与することが可能な熱伝導性フィラーを提供すること。【解決手段】平均粒子径が０．２〜１００μｍであり、熱伝導率が２０Ｗ／ｍＫ以上である等方性の高熱伝導性粒子と、該高熱伝導性粒子の平均粒子径の０．０１〜５倍の平均粒子径を有する非多孔性の六方晶窒化ホウ素粒子と、多孔性窒化ホウ素とを含有し、前記六方晶窒化ホウ素粒子及び前記多孔性窒化ホウ素により形成される窒化ホウ素相の空隙率が１０〜５０ｖｏｌ％である焼結体の粉砕物からなり、前記粉砕物中の全ての前記高熱伝導性粒子のうちの個数基準で４０％以上の粒子が、該高熱伝導性粒子の表面の少なくとも一部に前記多孔性窒化ホウ素を介して前記六方晶窒化ホウ素粒子が結合した複合粒子を形成していることを特徴とする熱伝導性フィラー。【選択図】なし
THERMALLY CONDUCTIVE FILLER, THERMALLY CONDUCTIVE COMPOSITE USING THE SAME, AND METHOD OF PRODUCING THERMALLY CONDUCTIVE FILLER
熱伝導性フィラー及びそれを用いた熱伝導性複合材料、並びに熱伝導性フィラーの製造方法
YAMADA YUKA (Autor:in) / TANAKA HIROMITSU (Autor:in) / SASAKI SHIGERU (Autor:in) / SUDA AKIHIKO (Autor:in) / MIYAZAKI AKIRA (Autor:in) / DEGUCHI MASATAKA (Autor:in)
01.04.2021
Patent
Elektronische Ressource
Japanisch
IPC:
C04B
Kalk
,
LIME
/
C01B
NON-METALLIC ELEMENTS
,
Nichtmetallische Elemente
/
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
/
C08L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
,
Massen auf Basis makromolekularer Verbindungen
/
C09K
Materialien für Anwendungen, soweit nicht anderweitig vorgesehen
,
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR
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