Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
KUPFER-KERAMIK-SUBSTRAT
The invention relates to a copper-ceramic substrate comprising a ceramic support and at least one copper layer bonded to a surface of the ceramic support, the copper layer having a Cu content of at least 99.5% Cu, the copper layer having an Ag content of at least 50 ppm, and the copper layer having an Ag content of not more than 3000 ppm.
KUPFER-KERAMIK-SUBSTRAT
The invention relates to a copper-ceramic substrate comprising a ceramic support and at least one copper layer bonded to a surface of the ceramic support, the copper layer having a Cu content of at least 99.5% Cu, the copper layer having an Ag content of at least 50 ppm, and the copper layer having an Ag content of not more than 3000 ppm.
KUPFER-KERAMIK-SUBSTRAT
COPPER-CERAMIC SUBSTRATE
SUBSTRAT EN CUIVRE-CÉRAMIQUE
CAPPI BENJAMIN (Autor:in) / LEHMANN HELGE (Autor:in)
04.12.2024
Patent
Elektronische Ressource
Deutsch
IPC:
C04B
Kalk
,
LIME