Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
COMPOSITE HEAT INSULATING MATERIAL AND MANUFACTURING METHOD THEREOF
PROBLEM TO BE SOLVED: To provide a composite heat insulating material having low thermal conductivity lower than 0.10 W/(mK) in 800°C, and superior in compressive strength to reduce deterioration by thermal load and heat expansion.SOLUTION: A compound heat insulating material consists of a base material 1 consisting of a heat insulating material with low thermal conductivity and a reinforcement material 2 consisting of a heat insulating material that strength characteristics is superior than the heat insulating material of the base material 1. The base material 1 and the reinforcement material 2 consist solid construction, the compressive strength is more than 1.0 MPa and the thermal conductivity is lower than 0.10 W/(mK) in 800°C. The reinforcement material 2 is buried and penetrating to a thickness direction of the base material 1, and it is preferable that the surface area of the reinforcement material 2 is 6-20% of all surface area.SELECTED DRAWING: Figure 1
【課題】８００℃において０.１０Ｗ／(ｍ・Ｋ)以下の小さい熱伝導率を有すると同時に、熱負荷や熱膨張による損傷を軽減し得るよう圧縮強さにも優れた複合断熱材を提供する。【解決手段】熱伝導率の小さい断熱材からなる母材１と、母材１の断熱材よりも強度特性が優れた断熱材からなる強化材２とからなる複合断熱材であって、母材１と強化材２とが一体構造となっていて、圧縮強さが１.０ＭＰａ以上で且つ８００℃での熱伝導率が０.１０Ｗ／(ｍ・Ｋ)以下である。強化材２は母材１の肉厚方向に貫通した状態で埋設されていて、強化材２の表面積が全表面積の６〜２０％であることが好ましい。【選択図】 図１
COMPOSITE HEAT INSULATING MATERIAL AND MANUFACTURING METHOD THEREOF
PROBLEM TO BE SOLVED: To provide a composite heat insulating material having low thermal conductivity lower than 0.10 W/(mK) in 800°C, and superior in compressive strength to reduce deterioration by thermal load and heat expansion.SOLUTION: A compound heat insulating material consists of a base material 1 consisting of a heat insulating material with low thermal conductivity and a reinforcement material 2 consisting of a heat insulating material that strength characteristics is superior than the heat insulating material of the base material 1. The base material 1 and the reinforcement material 2 consist solid construction, the compressive strength is more than 1.0 MPa and the thermal conductivity is lower than 0.10 W/(mK) in 800°C. The reinforcement material 2 is buried and penetrating to a thickness direction of the base material 1, and it is preferable that the surface area of the reinforcement material 2 is 6-20% of all surface area.SELECTED DRAWING: Figure 1
【課題】８００℃において０.１０Ｗ／(ｍ・Ｋ)以下の小さい熱伝導率を有すると同時に、熱負荷や熱膨張による損傷を軽減し得るよう圧縮強さにも優れた複合断熱材を提供する。【解決手段】熱伝導率の小さい断熱材からなる母材１と、母材１の断熱材よりも強度特性が優れた断熱材からなる強化材２とからなる複合断熱材であって、母材１と強化材２とが一体構造となっていて、圧縮強さが１.０ＭＰａ以上で且つ８００℃での熱伝導率が０.１０Ｗ／(ｍ・Ｋ)以下である。強化材２は母材１の肉厚方向に貫通した状態で埋設されていて、強化材２の表面積が全表面積の６〜２０％であることが好ましい。【選択図】 図１
COMPOSITE HEAT INSULATING MATERIAL AND MANUFACTURING METHOD THEREOF
複合断熱材及びその製造方法
SUEYOSHI ATSUSHI (Autor:in) / TSUNOMURA HISANORI (Autor:in)
18.08.2016
Patent
Elektronische Ressource
Japanisch
IPC:
F27D
Einzelheiten oder Zubehör für Industrieöfen, Schachtöfen, Brennöfen oder Retorten, soweit sie nicht auf eine Ofenart eingeschränkt sind
,
DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
/
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS
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