Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
PROBLEM TO BE SOLVED: To provide a polishing device which uniformly polishes a surface of a processed object such as a wire rope and enables easy attachment/detachment to/from the processed object.SOLUTION: A polishing device 100 includes: an annular polishing member 110 for polishing a processed object (wire rope) Rw; a housing 10 which rotatably holds the polishing member 110; and a driving part 20 which applies a rotational driving force to the polishing member 110 so that the processed object Rw inserted into the polishing member 110 is polished by rotation of the polishing member 110. The polishing member 110 and the housing 10 are formed so as to be splittable.SELECTED DRAWING: Figure 3
【課題】ワイヤロープなどの被処理物の表面を均一に研磨することができ、しかも被処理物への着脱作業を簡単に行うことができる磨き装置を得ること。【解決手段】磨き装置１００は、被処理物（ワイヤロープ）Ｒｗを磨くための環状の磨き部材１１０と、磨き部材１１０を回転可能に保持するハウジング１０と、磨き部材１１０に挿入された被処理物Ｒｗが磨き部材１１０の回転により磨かれるように磨き部材１１０に回転駆動力を印加する駆動部２０とを備え、磨き部材１１０およびハウジング１０がそれぞれ分割可能に構成されている。【選択図】 図３
PROBLEM TO BE SOLVED: To provide a polishing device which uniformly polishes a surface of a processed object such as a wire rope and enables easy attachment/detachment to/from the processed object.SOLUTION: A polishing device 100 includes: an annular polishing member 110 for polishing a processed object (wire rope) Rw; a housing 10 which rotatably holds the polishing member 110; and a driving part 20 which applies a rotational driving force to the polishing member 110 so that the processed object Rw inserted into the polishing member 110 is polished by rotation of the polishing member 110. The polishing member 110 and the housing 10 are formed so as to be splittable.SELECTED DRAWING: Figure 3
【課題】ワイヤロープなどの被処理物の表面を均一に研磨することができ、しかも被処理物への着脱作業を簡単に行うことができる磨き装置を得ること。【解決手段】磨き装置１００は、被処理物（ワイヤロープ）Ｒｗを磨くための環状の磨き部材１１０と、磨き部材１１０を回転可能に保持するハウジング１０と、磨き部材１１０に挿入された被処理物Ｒｗが磨き部材１１０の回転により磨かれるように磨き部材１１０に回転駆動力を印加する駆動部２０とを備え、磨き部材１１０およびハウジング１０がそれぞれ分割可能に構成されている。【選択図】 図３
POLISHING DEVICE
磨き装置
SUGANO WATARU (Autor:in)
22.12.2016
Patent
Elektronische Ressource
Japanisch
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