Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
HEAT ABSORPTION/RADIATION SEMICONDUCTOR MODULE, THAWING DEVICE, AND SNOW MELTING DEVICE
PROBLEM TO BE SOLVED: To provide a heat absorption/radiation semiconductor module that operates without an external power source.SOLUTION: P and N semiconductors 12 and 13 are alternately connected in series by a conductive connecting member 14 to form an internal circuit, and the terminal of the internal circuit is connected to a heat absorption/radiation semiconductor module 1, and a front side insulating layer 10 and a back side insulating layer 11 are put on the front and back surfaces of the internal circuit such that the conductive connecting members 14 are alternately joined to the front side insulating layer 10 and the back side insulating layer 11.SELECTED DRAWING: Figure 1
【課題】外部電源なしで動作する吸／放熱半導体モジュールを提供する。【解決手段】吸／放熱半導体モジュール１は、Ｐ、Ｎ半導体１２、１３を導電接続部材１４で交互に直列接続して内部回路を形成し、この内部回路の終端を接続させるとともに、それらの導電接続部材１４を交互に表側絶縁層１０と裏側絶縁層１１とに接合させるようにして、前記内部回路の表、裏面に表側絶縁層１０と裏側絶縁層１１とを被せた構成にしている。【選択図】図１
HEAT ABSORPTION/RADIATION SEMICONDUCTOR MODULE, THAWING DEVICE, AND SNOW MELTING DEVICE
PROBLEM TO BE SOLVED: To provide a heat absorption/radiation semiconductor module that operates without an external power source.SOLUTION: P and N semiconductors 12 and 13 are alternately connected in series by a conductive connecting member 14 to form an internal circuit, and the terminal of the internal circuit is connected to a heat absorption/radiation semiconductor module 1, and a front side insulating layer 10 and a back side insulating layer 11 are put on the front and back surfaces of the internal circuit such that the conductive connecting members 14 are alternately joined to the front side insulating layer 10 and the back side insulating layer 11.SELECTED DRAWING: Figure 1
【課題】外部電源なしで動作する吸／放熱半導体モジュールを提供する。【解決手段】吸／放熱半導体モジュール１は、Ｐ、Ｎ半導体１２、１３を導電接続部材１４で交互に直列接続して内部回路を形成し、この内部回路の終端を接続させるとともに、それらの導電接続部材１４を交互に表側絶縁層１０と裏側絶縁層１１とに接合させるようにして、前記内部回路の表、裏面に表側絶縁層１０と裏側絶縁層１１とを被せた構成にしている。【選択図】図１
HEAT ABSORPTION/RADIATION SEMICONDUCTOR MODULE, THAWING DEVICE, AND SNOW MELTING DEVICE
吸／放熱半導体モジュール、解凍装置及び融雪装置
NAKASHOYA HIDEO (Autor:in)
19.07.2018
Patent
Elektronische Ressource
Japanisch
| Europäisches Patentamt | 2021