Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
GROUND IMPROVEMENT DEVICE, GROUND IMPROVEMENT SYSTEM, AND GROUND IMPROVEMENT METHOD
To provide a ground improvement device, a ground improvement system, and a ground improvement method for improving the water bottom ground without requiring a pushing structure.SOLUTION: A ground improvement device 1 is suspended in water by a wire 2. When the ground improvement device 1 reaches a bottom, the tension applied to the wire 2 changes. When an operator recognizes that the ground improvement device 1 has bottomed, the operator supplies a ground improvement material from a ship to the ground improvement device 1 through a hose 3. Thereby, the ground improvement material is ejected to an outside from a side surface ejection port 11 or a bottom surface ejection port 12, and a water bottom ground 4 is cut by the ejected ground improvement material. Then, the ground improvement device 1 penetrates into the water bottom ground 4 by its own weight while cutting the water bottom ground 4.SELECTED DRAWING: Figure 2
【課題】押し込む構成を必要とせずに水底地盤を改良する地盤改良装置、地盤改良システム、及び地盤改良方法を提供する。【解決手段】地盤改良装置１はワイヤ２で水中に吊り下げられる。地盤改良装置１が着底するとワイヤ２にかかる張力が変化する。操作者は、地盤改良装置１が着底したことを認識すると、ホース３を通して船から地盤改良装置１へ地盤改良材を供給する。これにより、側面噴出口１１又は底面噴出口１２から地盤改良材が外部に噴出され、噴出した地盤改良材により水底地盤４が切削される。そして、地盤改良装置１は水底地盤４を切削しながら自重により水底地盤４に貫入する。【選択図】図２
GROUND IMPROVEMENT DEVICE, GROUND IMPROVEMENT SYSTEM, AND GROUND IMPROVEMENT METHOD
To provide a ground improvement device, a ground improvement system, and a ground improvement method for improving the water bottom ground without requiring a pushing structure.SOLUTION: A ground improvement device 1 is suspended in water by a wire 2. When the ground improvement device 1 reaches a bottom, the tension applied to the wire 2 changes. When an operator recognizes that the ground improvement device 1 has bottomed, the operator supplies a ground improvement material from a ship to the ground improvement device 1 through a hose 3. Thereby, the ground improvement material is ejected to an outside from a side surface ejection port 11 or a bottom surface ejection port 12, and a water bottom ground 4 is cut by the ejected ground improvement material. Then, the ground improvement device 1 penetrates into the water bottom ground 4 by its own weight while cutting the water bottom ground 4.SELECTED DRAWING: Figure 2
【課題】押し込む構成を必要とせずに水底地盤を改良する地盤改良装置、地盤改良システム、及び地盤改良方法を提供する。【解決手段】地盤改良装置１はワイヤ２で水中に吊り下げられる。地盤改良装置１が着底するとワイヤ２にかかる張力が変化する。操作者は、地盤改良装置１が着底したことを認識すると、ホース３を通して船から地盤改良装置１へ地盤改良材を供給する。これにより、側面噴出口１１又は底面噴出口１２から地盤改良材が外部に噴出され、噴出した地盤改良材により水底地盤４が切削される。そして、地盤改良装置１は水底地盤４を切削しながら自重により水底地盤４に貫入する。【選択図】図２
GROUND IMPROVEMENT DEVICE, GROUND IMPROVEMENT SYSTEM, AND GROUND IMPROVEMENT METHOD
地盤改良装置、地盤改良システム、及び地盤改良方法
AKIMOTO TEPPEI (Autor:in) / KUMAGAI TAKAHIRO (Autor:in) / UENO KAZUHIKO (Autor:in) / NGUYEN TANG THANH BINH (Autor:in)
29.08.2019
Patent
Elektronische Ressource
Japanisch
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