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    MANUFACTURING METHOD OF SPUTTERING TARGET MEMBER, AND SPUTTERING TARGET MEMBER

    Neue Suche nach: KUGE TOSHIHIRO

    To provide a manufacturing method of a sputtering target member capable of reducing occurrence of chipping at a machine work time.SOLUTION: A manufacturing method of a sputtering target includes a grinding step for grinding a sintered body, and a cutting step for obtaining a sintered body having at least one cut surface, by cutting the sintered body by using a rotary blade tool, while pouring cooling water exceeding 20 L/min to a contact point between the rotary blade tool and the sintered body, after the grinding step.SELECTED DRAWING: Figure 5

    【課題】機械加工時におけるチッピング発生の低減を図ったスパッタリングターゲット部材の製造方法を提供する。【解決手段】スパッタリングターゲット部材の製造方法であって、焼結体を研削する研削工程と、前記研削工程後に、回転刃具を用いて前記回転刃具と前記焼結体との接点に２０Ｌ／分を超えた冷却水を掛けながら前記焼結体を切断して、少なくとも１つの、切断面を有する前記焼結体を得る切断工程とを含む。【選択図】図５

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    MANUFACTURING METHOD OF SPUTTERING TARGET MEMBER, AND SPUTTERING TARGET MEMBER

    Neue Suche nach: KUGE TOSHIHIRO

    To provide a manufacturing method of a sputtering target member capable of reducing occurrence of chipping at a machine work time.SOLUTION: A manufacturing method of a sputtering target includes a grinding step for grinding a sintered body, and a cutting step for obtaining a sintered body having at least one cut surface, by cutting the sintered body by using a rotary blade tool, while pouring cooling water exceeding 20 L/min to a contact point between the rotary blade tool and the sintered body, after the grinding step.SELECTED DRAWING: Figure 5

    【課題】機械加工時におけるチッピング発生の低減を図ったスパッタリングターゲット部材の製造方法を提供する。【解決手段】スパッタリングターゲット部材の製造方法であって、焼結体を研削する研削工程と、前記研削工程後に、回転刃具を用いて前記回転刃具と前記焼結体との接点に２０Ｌ／分を超えた冷却水を掛けながら前記焼結体を切断して、少なくとも１つの、切断面を有する前記焼結体を得る切断工程とを含む。【選択図】図５

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    MANUFACTURING METHOD OF SPUTTERING TARGET MEMBER, AND SPUTTERING TARGET MEMBER

    Neue Suche nach: KUGE TOSHIHIRO

    To provide a manufacturing method of a sputtering target member capable of reducing occurrence of chipping at a machine work time.SOLUTION: A manufacturing method of a sputtering target includes a grinding step for grinding a sintered body, and a cutting step for obtaining a sintered body having at least one cut surface, by cutting the sintered body by using a rotary blade tool, while pouring cooling water exceeding 20 L/min to a contact point between the rotary blade tool and the sintered body, after the grinding step.SELECTED DRAWING: Figure 5

    【課題】機械加工時におけるチッピング発生の低減を図ったスパッタリングターゲット部材の製造方法を提供する。【解決手段】スパッタリングターゲット部材の製造方法であって、焼結体を研削する研削工程と、前記研削工程後に、回転刃具を用いて前記回転刃具と前記焼結体との接点に２０Ｌ／分を超えた冷却水を掛けながら前記焼結体を切断して、少なくとも１つの、切断面を有する前記焼結体を得る切断工程とを含む。【選択図】図５

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    Titel:

    MANUFACTURING METHOD OF SPUTTERING TARGET MEMBER, AND SPUTTERING TARGET MEMBER

    Weitere Titelangaben:

    スパッタリングターゲット部材の製造方法及びスパッタリングターゲット部材

    Beteiligte:

    KUGE TOSHIHIRO (Autor:in)

    Erscheinungsdatum:

    10.09.2020

    Medientyp:

    Patent

    Format:

    Elektronische Ressource

    Sprache:

    Japanisch

    Klassifikation:

    IPC:  C23C Beschichten metallischer Werkstoffe , COATING METALLIC MATERIAL / B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING , Maschinen, Einrichtungen oder Verfahren zum Schleifen oder Polieren / C04B Kalk , LIME

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