Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
COMPONENT FOR SEMICONDUCTOR MANUFACTURING DEVICE AND MANUFACTURING METHOD THEREOF
To provide a component for a semiconductor manufacturing device capable of obtaining more uniform temperature distribution than before.SOLUTION: A component 1 for a semiconductor manufacturing device includes a plate-shaped aluminum nitride sintered body 2 having a mounting surface on which a substrate is mounted, and the aluminum nitride sintered body 2 contains carbon. The aluminum nitride sintered body 2 is configured such that the thermal conductivity of the aluminum nitride sintered body 2 in the plane direction is higher than the thermal conductivity in the thickness direction. As a result, it is possible to provide a component for a semiconductor manufacturing device that suppresses heat from escaping in the thickness direction of the aluminum nitride sintered body 2 and can obtain more uniform temperature distribution than before.SELECTED DRAWING: Figure 1
【課題】従来よりも均一な温度分布が得られる半導体製造装置用部品を提供する。【解決手段】基板が載置される載置面を有する板状の窒化アルミニウム焼結体２を備える半導体製造装置用部品１の窒化アルミニウム焼結体２が炭素を含有する。窒化アルミニウム焼結体２は、窒化アルミニウム焼結体２の平面方向の熱伝導率が、厚み方向の熱伝導率よりも高くなるように構成されている。これにより、窒化アルミニウム焼結体２の厚み方向へ熱が逃げることを抑えて、従来よりも均一な温度分布が得られる半導体製造装置用部品を提供することができる。【選択図】図１
COMPONENT FOR SEMICONDUCTOR MANUFACTURING DEVICE AND MANUFACTURING METHOD THEREOF
To provide a component for a semiconductor manufacturing device capable of obtaining more uniform temperature distribution than before.SOLUTION: A component 1 for a semiconductor manufacturing device includes a plate-shaped aluminum nitride sintered body 2 having a mounting surface on which a substrate is mounted, and the aluminum nitride sintered body 2 contains carbon. The aluminum nitride sintered body 2 is configured such that the thermal conductivity of the aluminum nitride sintered body 2 in the plane direction is higher than the thermal conductivity in the thickness direction. As a result, it is possible to provide a component for a semiconductor manufacturing device that suppresses heat from escaping in the thickness direction of the aluminum nitride sintered body 2 and can obtain more uniform temperature distribution than before.SELECTED DRAWING: Figure 1
【課題】従来よりも均一な温度分布が得られる半導体製造装置用部品を提供する。【解決手段】基板が載置される載置面を有する板状の窒化アルミニウム焼結体２を備える半導体製造装置用部品１の窒化アルミニウム焼結体２が炭素を含有する。窒化アルミニウム焼結体２は、窒化アルミニウム焼結体２の平面方向の熱伝導率が、厚み方向の熱伝導率よりも高くなるように構成されている。これにより、窒化アルミニウム焼結体２の厚み方向へ熱が逃げることを抑えて、従来よりも均一な温度分布が得られる半導体製造装置用部品を提供することができる。【選択図】図１
COMPONENT FOR SEMICONDUCTOR MANUFACTURING DEVICE AND MANUFACTURING METHOD THEREOF
半導体製造装置用部品およびその製造方法
OKI KEISUKE (Autor:in)
15.02.2021
Patent
Elektronische Ressource
Japanisch
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